FMM300-0055P

FET, MOSFET Arrays Overview

The FMM300-0055P is a dual N-channel power MOSFET array manufactured by IXYS. It utilizes Trench technology and is housed in an i4-PAC™-5 package designed for through-hole mounting. The device supports a drain-to-source voltage of 55V and a continuous drain current of 300A. Key electrical parameters include a maximum on-resistance of 3.6 mOhms at 150A with a 10V gate drive. The junction temperature range extends from -55°C to 175°C, ensuring reliability in high-power environments.

FET, MOSFET Arrays Feature Summary

• Dual N-channel configuration within a single integrated package
• Trench power MOSFET technology for low conduction losses
• High thermal stability supporting extended junction temperatures

FET, MOSFET Arrays Applications

• High-current DC-DC converter circuits
• Motor control systems requiring robust switching
• Power management modules in industrial equipment

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix and package variant against the official IXYS datasheet to ensure compatibility with your PCB footprint and thermal requirements. Confirm that the component meets all relevant RoHS directives and quality standards required for your manufacturing process before finalizing orders.

FET, MOSFET Arrays Selection Notes

Select this component when designing circuits demanding high current handling capabilities within a compact dual-MOSFET form factor. The low on-resistance makes it suitable for applications where efficiency and heat dissipation are critical constraints compared to standard single-channel alternatives.

FET, MOSFET Arrays Part Context

This part belongs to the FMM series of discrete semiconductor products, specifically categorized under FET arrays. It represents IXYS's solution for integrating multiple power switches into a unified module, simplifying board layout while maintaining high performance standards for power electronics.

FET, MOSFET Arrays Replacement Considerations

Consult official cross-reference lists for verified substitutes. Ensure any alternative maintains identical pinout, voltage ratings, and thermal characteristics to avoid redesigning the host circuitry or compromising system safety margins.