FP10R06KL4BOMA1

Overview

The FP10R06KL4BOMA1 is a high-power Insulated Gate Bipolar Transistor (IGBT) module manufactured by Infineon Technologies. It belongs to the PrimePACK™ 3 family, designed for industrial motor drives and power conversion applications. The device features an N-channel configuration with a collector-emitter saturation voltage optimized for low conduction losses. Key electrical parameters include a maximum collector current of 10A and a breakdown voltage of 600V. The module utilizes a copper-clad direct bond copper substrate for superior thermal conductivity and mechanical stability. It integrates an anti-parallel fast recovery diode to support inductive load switching. The component is housed in a standardized PrimePACK™ 3 package, facilitating automated assembly and efficient heat dissipation through the baseplate.

Feature Summary

• Integrated IGBT and diode pair within a single insulated module structure
• Optimized saturation voltage characteristics for reduced conduction losses
• Direct Bond Copper substrate for enhanced thermal management and reliability
• Standardized footprint compatible with existing PrimePACK™ 3 cooling solutions

Applications

• Industrial servo drives and AC motor control systems
• Uninterruptible Power Supplies (UPS) and inverters
• Switched-mode power supplies and DC-DC converters

Procurement Notes

Verify the specific ordering suffix against the official Infineon datasheet to ensure correct pinout and thermal interface specifications. Confirm that the procurement channel provides traceable documentation for automotive or industrial grade requirements if applicable. Cross-reference the lot code with manufacturer records to validate authenticity and storage history prior to integration into critical power electronics designs.

Selection Notes

Select this component when designing circuits requiring a compact, high-reliability half-bridge solution with moderate current ratings. Ensure the thermal design accommodates the junction-to-case thermal resistance specified in the datasheet under the expected duty cycle. Verify that the gate drive voltage limits align with the module's absolute maximum ratings to prevent dielectric breakdown during transient events.

Part Context

This module is part of Infineon’s PrimePACK™ 3 series, which standardizes mechanical dimensions for easy replacement across different current ratings within the same family. It serves as a core switching element in three-phase inverter bridges. The design focuses on minimizing parasitic inductance and improving short-circuit withstand capability compared to previous generation modules.

Replacement Considerations

Consult Infineon’s official cross-reference guide for verified alternatives. Direct replacements must match the PrimePACK™ 3 mechanical outline and electrical ratings. Generic equivalents may differ in thermal performance or switching speed; verify compatibility with existing gate drivers and heatsink interfaces before substitution.