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Product Detailed Parameters
- Description：IGBT MODULE 1200V 150A
- Series：EconoPIM™ 3
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 150A
- Input：Three Phase Bridge Rectifier
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：150 A
- Power - Max：-
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：9.35 nF @ 25 V
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Overview
The FP150R12KT4B11BPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the TRENCHSTOP™ IGBT4 - T4 series. It features an EconoPIM™ 3 housing and is configured as a three-phase inverter with a three-phase input rectifier. The device supports a maximum collector-emitter voltage (VCEO) of 1.2 kV and delivers a continuous collector current (Ic) of 150 A at 25°C. The typical collector-emitter saturation voltage (Vce(sat)) is 1.75 V. It operates within a junction temperature range of -40°C to +150°C and utilizes through-hole mounting.
Feature Summary
- Integrates TRENCHSTOP™ IGBT4 technology for optimized switching performance and low conduction losses.
- Features an integrated NTC thermistor for precise thermal monitoring and protection.
- Utilizes copper base plate construction to enhance power cycling capability and thermal conductivity.
- Provides compact packaging flexibility with standard housing design.
Applications
- Three-phase motor drives and industrial automation systems
- Uninterruptible power supplies (UPS)
- Induction heating equipment
Procurement Notes
Verify the complete ordering code including suffixes such as B11 and PSA1 against official Infineon documentation to ensure correct configuration. Confirm RoHS compliance status and specific datasheet revisions prior to procurement. Cross-reference manufacturer part numbers with distributor listings to validate authenticity and traceability.
Selection Notes
Select this component for applications requiring high current density in a compact form factor. Ensure the cooling solution accommodates the thermal characteristics of the EconoPIM 3 package. Verify that gate drive requirements align with the T4 technology specifications. Consider the operating temperature range limits when designing the thermal management system.
Part Context
This module is part of the broader FP150R12KT4 family, which includes variants like FP150R12KT4P_B11 and FP150R12KT4PB11BPSA1. These components share similar electrical ratings but may differ in packaging details or specific suffix configurations. The T4 generation represents a significant evolution in Infineon's IGBT portfolio, focusing on efficiency improvements over previous generations.
Replacement Considerations
Direct substitutes include FP150R12KT4P_B11 and FP150R12KT4PB11BPSA1. Verify pinout compatibility and thermal interface requirements before substitution. Alternative packages such as EconoPACK may require mechanical redesign.
