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The FP20R06W1E3B3BPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the EconoPACK 3 series. It features a Trench/Fieldstop IGBT technology with an integrated NTC thermistor for thermal monitoring. The device is configured as a six-pack unit rated for 600V collector-emitter voltage and 20A continuous collector current at 25°C. Key electrical parameters include a saturation voltage of 1.55V, a maximum gate-emitter voltage of ±20V, and a power dissipation capacity of 135W. It operates within a temperature range of -40°C to +150°C and utilizes screw mount installation in an EASY1B package.
Verify the exact part number against official Infineon documentation, as the provided model string may contain non-standard suffixes or typos compared to standard ordering codes. Confirm that the specific revision matches the required technical specifications before procurement. Ensure compatibility with existing cooling solutions and gate drive circuits. Cross-reference datasheets to validate pinout and thermal characteristics.
Select this component for applications requiring robust 600V switching capabilities with moderate current ratings. The integrated NTC sensor simplifies thermal management strategies by providing direct junction temperature feedback. Consider the 135W power dissipation limit when designing heatsinking systems. Verify that the operating environment stays within the specified -40°C to +150°C range to ensure reliability.
This module is part of Infineon's EconoPACK 3 family, designed for high-density power electronics. It combines IGBTs with anti-parallel diodes in a single compact package. The series is known for reducing parasitic inductances and improving thermal performance compared to previous generations. It serves as a core switching element in various power conversion topologies.
Consult official Infineon substitution guides for verified alternatives. Generic replacements may differ in thermal resistance or switching speeds. Ensure any substitute maintains compatible pinouts and voltage/current ratings. Verify that alternative components also support the required mounting style and package dimensions.