FP50R12N2T7B76BPSA1

$57.43

Description：LOW POWER ECONO
Series：-

SKU:dee80a3d655c Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：LOW POWER ECONO
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：Trench Field Stop
Configuration：Three Phase Inverter
Vce(on) (Max) @ Vge, Ic：1.5V @ 15V, 50A
Input：Three Phase Bridge Rectifier
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：AG-ECONO2B
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：50 A
Power - Max：-
Current - Collector Cutoff (Max)：10 µA
Input Capacitance (Cies) @ Vce：11100 pF @ 25 V

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FP50R12N2T7B76BPSA1

Overview

The FP50R12N2T7B76BPSA1 is a PIM IGBT module from Infineon Technologies rated at 1200 V and 50 A. It utilizes trench field stop IGBT technology in a three-phase inverter configuration. The component integrates high-power density switching capabilities suitable for demanding industrial power conversion applications requiring robust thermal performance and efficient energy management.

Feature Summary

Integrates trench field stop IGBT technology for optimized switching performance
Configured as a three-phase inverter module for compact system design
Rated for 1200 V blocking voltage and 50 A continuous current operation

Applications

Industrial motor drives
Uninterruptible power supplies (UPS)
Induction heating systems

Procurement Notes

Verify the specific datasheet revision and ordering suffix to ensure compatibility with required thermal interface materials and gate drive characteristics. Confirm that the package dimensions and terminal configurations match the target PCB layout or busbar assembly specifications before finalizing procurement orders.

Selection Notes

Select this module when a 1200 V rating and 50 A current capacity are required for three-phase inverter topologies. Consider the thermal resistance characteristics and mounting requirements of the PIM form factor against the available cooling infrastructure in the application environment.

Part Context

This component belongs to Infineon's portfolio of intelligent power modules designed for medium-power applications. It represents a solution combining multiple semiconductor chips within a single insulated package to reduce parasitic inductances and simplify assembly processes compared to discrete component implementations.