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The FP75R12KT4PB11BPSA1 is a PIM IGBT module from Infineon Technologies, rated at 1200 V and 75 A. It features a three-phase input rectifier configuration with integrated IGBTs and diodes. The module utilizes Trenchstop technology for low saturation voltage and switching losses. It includes an integrated NTC thermistor for thermal monitoring. The package design supports screw mounting within a standard housing on a copper baseplate. Operating temperatures range from -40 °C to +175 °C.
Verify the complete part number including suffixes such as BPSA1 against official Infineon documentation to ensure correct packaging and tape-and-reel specifications. Confirm that the specific revision matches the required datasheet version for accurate electrical parameters. Cross-reference the manufacturer date code to ensure component freshness and storage conditions compliance prior to integration into production systems.
Select this module for applications requiring a compact three-phase rectifier combined with IGBT switching capabilities. Ensure the thermal management system can handle the specified power dissipation at the maximum junction temperature. Verify that the gate drive circuitry aligns with the internal gate resistor and charge requirements. Confirm mechanical compatibility with the EconoPIM3 housing dimensions and screw mounting patterns for the target PCB or heatsink assembly.
This component belongs to the EconoPIM3 series utilizing Trenchstop IGBT4 technology. It combines a three-phase bridge rectifier with IGBT switches in a single package. The series is designed for industrial motor control and power conversion applications where space efficiency and thermal performance are critical. It represents a generation of modules optimized for reduced switching losses and improved short-circuit robustness compared to earlier generations.
Direct replacements must match the 1200V/75A rating and EconoPIM3 footprint. Consider FP75R12KT4BOSA1 for similar technical specifications but verify if the packaging suffix difference impacts board layout or handling procedures. Ensure any substitute maintains the same pinout configuration and thermal resistance characteristics to avoid redesigning the cooling solution.