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FPDB60PH60B is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists onsemi. Its product description is MODULE SPM 600V 60A SPMHC. Review the specifications below when checking this part for your BOM.
The FPDB60PH60B is a Smart Power Module (SPM) from the PFC SPM 3 series, manufactured by onsemi. It integrates an IGBT-based power stage designed for bridgeless Power Factor Correction (PFC) applications. The module features a 600V voltage rating and supports a continuous current of 60A. It utilizes a 27-PowerDIP package with bias pins and provides 2500Vrms isolation. This component is classified as Not Recommended for New Designs.
Verify the Not Recommended for New Design status before initiating any new product development projects. Confirm that the 27-PowerDIP package dimensions and pinout match the target PCB layout requirements. Ensure compatibility with existing thermal management solutions given the module's power dissipation characteristics. Check for available legacy stock if immediate replacement is required.
Select this module for designs requiring integrated bridgeless PFC functionality to reduce component count and board space. Consider the 60A current rating and 600V blocking voltage for appropriate load handling. Evaluate the thermal performance within the 27-PowerDIP package against system cooling capabilities. Verify that the integrated driver requirements align with the control logic voltage levels.
This component belongs to the PFC SPM 3 series, which consolidates multiple discrete components into a single intelligent module. The series targets high-efficiency power factor correction applications. The FPDB60PH60B specifically addresses two-phase bridgeless topologies, offering a compact alternative to traditional discrete implementations.
Check for direct substitutes within the FPDB or FPAB series with matching voltage and current ratings. Verify pin-to-pin compatibility with alternative modules from onsemi or other manufacturers. Ensure that any replacement maintains the required 2500Vrms isolation and package form factor.
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