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Product Detailed Parameters
- Description：IGBT MODULE 650V 40A 156W F2
- Series：-
- Mfr：onsemi
- Package：Bulk,Tray,Tray
- IGBT Type：Field Stop
- Configuration：3 Independent
- Vce(on) (Max) @ Vge, Ic：2.2V @ 15V, 40A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Through Hole
- Package / Case：Module
- Supplier Device Package：F2
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：40 A
- Power - Max：156 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：-
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Overview
The FPF2G120BF07ASP is a triple IGBT module manufactured by onsemi, housed in the F2 package. It features a maximum collector-emitter voltage of 650V and a continuous collector current of 40A. The typical collector-emitter saturation voltage is 1.55V, with a maximum power dissipation of 156W. The device supports a maximum operating temperature of +150°C and has a maximum gate-emitter voltage rating of 20V.
Feature Summary
- Triple IGBT configuration for high-power applications
- Robust thermal performance with 156W power dissipation capability
- High voltage tolerance suitable for industrial inverters
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Inverter circuits
Procurement Notes
Verify the specific suffix 'F07AS' against official datasheets to confirm pinout and electrical characteristics, as packaging variants may differ. Ensure the supplier provides original manufacturer documentation to validate authenticity. Check for RoHS compliance status if required by your assembly process. Confirm the F2 package dimensions match your PCB layout constraints before finalizing orders.
Selection Notes
Select this component for applications requiring a 650V rating and 40A current capacity in a compact F2 footprint. Consider the 1.55V saturation voltage for efficiency calculations in switching applications. Evaluate thermal management requirements given the 156W dissipation limit. Compare against single IGBT modules if higher current density or different configuration is needed.
Part Context
This part belongs to onsemi's discrete semiconductor product line, specifically within the IGBT module category. The F2 package is designed for surface-mount installation, offering a balance between power handling and board space efficiency. It is intended for use in medium-power conversion systems where reliability and thermal stability are critical.
Replacement Considerations
Consult official cross-reference lists for direct substitutes. Verify that any alternative maintains the 650V Vces, 40A Ic, and triple configuration. Ensure the replacement package matches the F2 form factor for compatibility.
