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FS03MR12A6MA1LB is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 6N-CH 1200V AG-HYBRIDD. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for FS03MR12A6MA1LB
- Description：MOSFET 6N-CH 1200V AG-HYBRIDD
- Series：HybridPACK™
- Mfr：Infineon Technologies
- Package：Tray
- Technology：Silicon Carbide (SiC)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：400A
- Rds On (Max) @ Id, Vgs：3.7mOhm @ 400A, 15V
- Vgs(th) (Max) @ Id：5.55V @ 240mA
- Gate Charge (Qg) (Max) @ Vgs：1320nC @ 15V
- Input Capacitance (Ciss) (Max) @ Vds：42600pF @ 600V
- Power - Max：-
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-HYBRIDD-2
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for FS03MR12A6MA1LB
FET, MOSFET Arrays Overview
The FS03MR12A6MA1LB is a HybridPACK Drive module utilizing CoolSiC Automotive MOSFET technology. It features a 1200 V drain-source voltage and a nominal DC drain current of 400 A at a junction temperature of 175 °C. The device incorporates silicon carbide semiconductor material to achieve low on-resistance and switching losses, with a stray inductance of 8.5 nH. It supports an operating junction temperature up to 150 °C and includes an integrated NTC thermistor for thermal monitoring.
FET, MOSFET Arrays Feature Summary
- Automotive-grade qualification compliant with AQG 324 standards
- Direct-cooled PinFin base plate design for high power density
- Integrated NTC temperature sensor for thermal management
- PressFIT contact technology for PCB and cooler assembly
FET, MOSFET Arrays Applications
- (Hybrid) electric vehicles (H)EV motor drives
- Commercial agriculture vehicle motor drives
- General automotive traction applications
FET, MOSFET Arrays Procurement Notes
Verify the specific ordering suffix LB against official Infineon documentation to confirm mechanical and electrical specifications. Ensure compatibility with required gate drivers and cooling systems. Confirm that the application environment meets the specified insulation coordination and thermal requirements defined in the datasheet.
FET, MOSFET Arrays Selection Notes
Select this module for applications requiring automotive reliability and high efficiency. Consider the 1200 V rating and 400 A current capacity for system design. Evaluate the thermal resistance and cooling fluid requirements to ensure optimal performance within the specified operating temperature range.
FET, MOSFET Arrays Part Context
This component belongs to the HybridPACK Drive family from Infineon Technologies. It is designed specifically for automotive power electronics, leveraging silicon carbide technology to enhance efficiency and power density compared to traditional silicon-based solutions.
FET, MOSFET Arrays Replacement Considerations
Consult official Infineon resources for verified substitute part numbers. Do not assume cross-compatibility with other modules without verifying pinout, electrical ratings, and mechanical dimensions.
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