FS13MR12W2M1HPB11BPSA1

$164.61

Description：MOSFET
Series：-

SKU:5b3ab3f16baf Category: FET, MOSFET Arrays Brand: Infineon Technologies

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Product introduction

FS13MR12W2M1HPB11BPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for FS13MR12W2M1HPB11BPSA1

Description：MOSFET
Series：-
Mfr：Infineon Technologies
Package：Tray
Technology：-
Configuration：-
FET Feature：-
Drain to Source Voltage (Vdss)：-
Current - Continuous Drain (Id) @ 25°C：-
Rds On (Max) @ Id, Vgs：-
Vgs(th) (Max) @ Id：-
Gate Charge (Qg) (Max) @ Vgs：-
Input Capacitance (Ciss) (Max) @ Vds：-
Power - Max：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

FET, MOSFET Arrays datasheet and documents for FS13MR12W2M1HPB11BPSA1

FS13MR12W2M1HPB11BPSA1

FET, MOSFET Arrays Overview

The FS13MR12W2M1HP_B11 is a CoolSiC™ Trench MOSFET EasyPACK™ module featuring PressFIT contacts, integrated NTC sensor, and pre-applied TIM. It provides a drain-source voltage of 1200 V, continuous DC current of 50 A at 175°C junction temperature, and repetitive peak current of 125 A. The on-resistance is 11.7 mΩ at 25°C. Stray inductance is 13 nH, with thermal resistance from junction to heat sink at 1.19 K/W.

FET, MOSFET Arrays Feature Summary

Utilizes PressFIT contact technology for robust mounting without screws.
Integrates an NTC temperature sensor for precise thermal monitoring.
Includes pre-applied thermal interface material to simplify assembly.
Features low inductive design with minimal stray inductance.

FET, MOSFET Arrays Applications

High-frequency switching applications
Motor drives
UPS systems
DC/DC converters
EV DC chargers

FET, MOSFET Arrays Procurement Notes

Verify the datasheet revision matches the specific production batch requirements. Confirm that the application environment adheres to the industrial qualification standards defined in IEC 60747, 60749, and 60068. Ensure gate drive voltages remain within the specified transient and static limits to maintain device reliability over its operational lifetime.

FET, MOSFET Arrays Selection Notes

Select this module for designs requiring high switching frequencies and rugged mechanical integration. The PressFIT interface eliminates screw-mounting complexity while ensuring consistent contact pressure. Consider the integrated NTC for closed-loop thermal management. Verify that the system's thermal design can accommodate the specified junction-to-heat sink thermal resistance under maximum load conditions.

FET, MOSFET Arrays Part Context

This component belongs to Infineon's EasyPACK™ series utilizing CoolSiC™ Trench MOSFET technology. It is designed for industrial power conversion applications where high efficiency and compact form factors are critical. The module integrates advanced silicon carbide semiconductors with specialized packaging features to enhance performance and ease of use in demanding power electronic environments.

FET, MOSFET Arrays Replacement Considerations

Consult official Infineon documentation for direct pin-compatible substitutes within the same CoolSiC™ family. Verify electrical parameters and thermal characteristics before substituting. No alternative part numbers are confirmed in the provided source material.