FS150R12W3T7B11BPSA1

Overview

The FS150R12W3T7_B11 is a single-trench IGBT module from Infineon's EasyPACK™ series, utilizing TRENCHSTOP™ IGBT7 technology. It features a 1200 V collector-emitter voltage and a nominal continuous DC collector current of 150 A at 175 °C junction temperature. The device incorporates an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C. Electrical characteristics include a typical saturation voltage of 1.55 V and a maximum repetitive peak collector current of 300 A. The module employs PressFIT contact technology for board mounting.

Feature Summary

• Utilizes TRENCHSTOP™ IGBT7 micro-pattern trench technology for enhanced controllability and reduced switching losses.
• Features an Al2O3 substrate providing low thermal resistance and high power cycling capability.
• Incorporates emitter-controlled diodes to minimize forward voltage drop and reverse recovery energy.
• Includes an integrated NTC temperature sensor for precise thermal monitoring.

Applications

• Auxiliary inverters
• Motor drives
• Servo drives

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm mechanical interface and electrical configuration. Ensure compliance with industrial qualification standards such as IEC 60747 and IEC 60068 before integration. Confirm that the application environment supports the specified operating temperature range up to 175 °C.

Selection Notes

Select this component for applications requiring high thermal cycling endurance and low stray inductance. The 15 nH internal stray inductance supports high-speed switching operations. Verify that the gate drive circuitry accommodates the ±20 V peak gate-emitter voltage rating and the specific internal gate resistor values.

Part Context

This module belongs to the EasyPACK™ family designed for compact power electronics. It represents the seventh generation of TRENCHSTOP™ technology, superseding previous generations like TRENCHSTOP™5. The product is specifically engineered for industrial applications demanding robust performance under overload conditions.

Replacement Considerations

Consult official replacement lists for direct substitutes. Cross-referencing requires matching voltage ratings, current capabilities, and package dimensions. Verify compatibility with existing PCB layouts due to the PressFIT termination style.

FAQ

What is the maximum allowable junction temperature for operation?

The maximum junction temperature under switching conditions is 175 °C. Operation above 150 °C is permitted for overload conditions as per application note AN 2018-14.

How is the module mechanically connected to the PCB?

The module uses PressFIT contact technology for connection to the printed circuit board, eliminating the need for soldering the main power terminals.

What is the short-circuit withstand time of the IGBT?

The IGBT can withstand a short-circuit condition for up to 8 µs at a junction temperature of 150 °C and up to 7 µs at 175 °C.