ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MOD 1200V 25A 110W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Full Bridge Inverter
- Vce(on) (Max) @ Vge, Ic：2.15V @ 15V, 15A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：25 A
- Power - Max：110 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：1.1 nF @ 25 V
Download product information
Overview
The FS15R12YT3BOMA1 is a silicon IGBT module from Infineon Technologies, belonging to the EasyPIM series. It features a 3-phase inverter configuration with a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 15 A at 25°C. The device exhibits a typical collector-emitter saturation voltage of 1.6 V and operates within a temperature range of -40°C to +175°C. Packaged in the EASY2 form factor, it integrates gate drive components for simplified implementation in power conversion systems.
Feature Summary
- Integrates three-phase inverter topology within a single compact package
- Incorporates Trenchstop IGBT7 technology for optimized switching performance
- Includes integrated gate driver circuitry for direct control interface
Applications
- Motor drives and servo amplifiers
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific ordering suffix against official Infineon documentation to confirm exact electrical characteristics and packaging details. Ensure compatibility with existing thermal management solutions and gate drive requirements before integration into the design.
Selection Notes
Select this component for applications requiring a balanced combination of moderate current handling and high voltage blocking capability. Evaluate the thermal resistance of the EASY2 package against the expected duty cycle and ambient conditions to ensure reliable operation within the specified temperature limits.
Part Context
This module is part of the EasyPIM family, designed to reduce board space and simplify assembly by integrating power switches and drivers. It serves as an alternative to discrete component solutions, offering improved reliability through reduced interconnection parasitics in medium-power industrial applications.
Replacement Considerations
Consult official Infineon cross-reference guides for verified substitutes. Ensure any replacement maintains equivalent voltage ratings, current capacity, and pinout compatibility to avoid redesigning the PCB or thermal interface.
