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The FS200R12N3T7BPSA1 is an EconoPACK™3 IGBT module featuring TRENCHSTOP™ IGBT7 technology and emitter-controlled diodes. It provides a collector-emitter voltage of 1200 V and a nominal continuous DC collector current of 200 A at 75°C case temperature, with a repetitive peak current capability of 400 A. The module integrates an NTC thermistor for thermal monitoring and utilizes solder contact technology on an Al2O3 substrate with a copper base plate. Qualified for industrial applications, it supports overload operation up to 175°C junction temperature.
Verify the specific ordering suffix BPSA1 against official Infineon documentation to confirm exact packaging and marking specifications. Ensure that procurement channels provide valid traceability data consistent with industrial qualification standards. Confirm compliance with relevant safety norms before finalizing acquisition.
Select this module for applications requiring robust industrial-grade performance and high thermal cycling endurance. Evaluate the 1200 V rating and 200 A current capacity against system load requirements. Consider the integrated NTC sensor for simplified thermal protection circuitry design in motor drive or inverter topologies.
This component belongs to the Infineon EconoPACK™3 series, designed for compact and efficient power conversion. It incorporates TRENCHSTOP™ IGBT7 technology, which offers optimized switching characteristics and low saturation voltage compared to previous generations, enhancing overall system efficiency in industrial power electronics.
Consult official Infineon cross-reference guides for verified substitutes. Direct replacements must match the 1200 V rating, 200 A current class, and EconoPACK™3 footprint while maintaining equivalent thermal and electrical performance characteristics.
The module supports an operating junction temperature range from -40°C to +175°C. Operation above 150°C is permitted only under overload conditions as specified in application notes.
Yes, the FS200R12N3T7BPSA1 features an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C for precise thermal monitoring.
The module utilizes solder contact technology between the chips and the substrate/base plate to ensure high reliability and thermal cycling capability.