ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE LOW POWER EASY
- Series：EasyPACK™, TRENCHSTOP™
- Mfr：Infineon Technologies
- Package：Bulk,Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：1.6V @ 15V, 25A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-EASY1B
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：25 A
- Power - Max：-
- Current - Collector Cutoff (Max)：5.6 µA
- Input Capacitance (Cies) @ Vce：4.77 nF @ 25 V
Download product information
Overview
The FS25R12W1T7B11BOMA1 is a six-pack IGBT module from Infineon Technologies, utilizing TRENCHSTOP™ IGBT7 technology. It features a collector-emitter voltage of 1200 V and a nominal continuous DC collector current of 25 A at 175°C junction temperature. The device incorporates emitter-controlled diodes with a forward current rating of 35 A. Electrical characteristics include a typical saturation voltage of 1.60 V and a forward voltage of 1.72 V at 25°C. The module employs PressFIT contact technology and includes an integrated NTC thermistor for thermal monitoring.
Feature Summary
- Integrates TRENCHSTOP™ IGBT7 and emitter-controlled diodes for optimized switching performance
- Utilizes PressFIT contact technology to eliminate solder joints and enhance mechanical reliability
- Features an Al2O3 substrate providing high power density and low thermal resistance
- Includes an integrated NTC thermistor for precise internal temperature monitoring
Applications
- Motor drives
- Air conditioning systems
- Auxiliary inverters
- Servo drives
- UPS systems
Procurement Notes
Verify the specific ordering suffix against official documentation to confirm exact configuration details. Ensure compatibility with recommended gate drivers listed in the datasheet. Confirm that the application environment meets the industrial qualification standards defined by IEC 60747, 60749, and 60068 before deployment.
Selection Notes
Select this component for applications requiring robust overload capability up to 175°C. The low stray inductance design supports high-frequency switching operations. Verify that the required mounting force falls within the specified 40 to 80 N range per clamp to ensure proper electrical connection and thermal interface integrity.
Part Context
This module belongs to the EasyPACK™ series, designed for compact integration in modern power electronics. It represents the seventh generation of TRENCHSTOP™ technology, offering improved controllability and reduced losses compared to previous generations. The package is specifically engineered for industrial-grade reliability and high power density requirements.
Replacement Considerations
Direct substitutes are not explicitly confirmed in public documentation. Evaluate alternatives based on matching voltage ratings, current capabilities, and package dimensions. Verify that any replacement maintains compatible switching characteristics and thermal resistance values for the intended application.
FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature under switching conditions is 175°C.
Does the module include short-circuit ruggedness?
Yes, the device supports short-circuit operation with a peak current of 80 A for pulses up to 8 µs at 150°C.
What insulation level does the module provide?
The module provides 2.5 kV AC isolation for one minute using an Al2O3 substrate with basic insulation class 1.
