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The FS300R17OE4B81BPSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology with an Emitter Controlled 3 diode. It features PressFIT connection technology and an integrated NTC temperature sensor. The collector-emitter voltage (VCES) is rated at 1700 V, with a continuous DC collector current (ICDC) of 300 A at TC = 100°C. The repetitive peak collector current (ICRM) reaches 600 A for 1 ms pulses. The maximum operating junction temperature (Tvj op) is 150°C. Key electrical parameters include a typical VCEsat of 1.95 V at Tvj = 25°C and a gate threshold voltage (VGEth) ranging from 5.20 V to 6.40 V.
Verify the specific ordering suffix B81 against official documentation to confirm exact configuration details. Confirm RoHS compliance status through the manufacturer's latest release notes. Ensure that sourcing channels provide valid traceability data for industrial quality standards. Cross-reference datasheet version V3.0 for accurate technical specifications before finalizing procurement orders.
Select this module for applications requiring 1700 V blocking capability and 300 A continuous current handling. Consider the PressFIT termination method for assembly requirements. Evaluate thermal management needs based on the specified RthJC values. Verify compatibility with driving circuits regarding the internal gate resistor and required gate voltages for optimal switching performance.
This component belongs to the EconoPACK+ series by Infineon Technologies. It integrates Trench/Fieldstop IGBT4 technology with Emitter Controlled 3 diodes. The module utilizes PressFIT contact technology for reliable connections. It is designed for industrial power electronics applications requiring high reliability and robust electrical performance under demanding conditions.
Consult official Infineon documentation for confirmed substitute part numbers. Verify pinout compatibility and electrical ratings before considering alternatives. Ensure thermal resistance characteristics match the existing design constraints.