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Product Detailed Parameters
- Description：FS3L40R12W2H7PB11BPSA1
- Series：EasyPACK™
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 35A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：25 A
- Power - Max：-
- Current - Collector Cutoff (Max)：24 µA
- Input Capacitance (Cies) @ Vce：25200 pF @ 25 V
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Overview
The FS3L40R12W2H7PB11BPSA1 is a three-level IGBT module from Infineon Technologies, utilizing the EasyPACk™ 3B housing. It features an active neutral point clamp (ANPC) topology and press-fit termination technology. The device incorporates IGBT7 S7 technology with a nominal collector current of 40 A and a maximum voltage rating of 1200 V. Key electrical parameters include a typical saturation voltage of 1.95 V at 25°C and a forward voltage of 2.65 V for the integrated diode. The module is designed for industrial applications requiring high reliability and efficient thermal management.
Feature Summary
- Active Neutral Point Clamp (ANPC) topology for reduced switching losses
- IGBT7 S7 technology for enhanced controllability and lower on-state voltage
- Press-fit termination for robust mechanical connection without soldering
- Integrated NTC thermistor for precise temperature monitoring
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Solar photovoltaic inverters
Procurement Notes
Verify the exact part number suffix against official Infineon documentation to ensure correct configuration. Confirm RoHS compliance status and specific qualification reports relevant to your application environment. Check for any recent lifecycle notices or recommended replacements before finalizing procurement plans.
Selection Notes
Select this module for applications requiring high efficiency in three-level topologies. Ensure the gate driver supports the required current drive capabilities for IGBT7 technology. Verify thermal interface material compatibility with the press-fit baseplate for optimal heat dissipation performance.
Part Context
This component belongs to Infineon's EasyPACk™ series, designed for compact power conversion solutions. The FS3L... designation indicates a three-phase or multi-leg configuration within the ANPC family. It represents a modern iteration of IGBT modules focusing on system-level efficiency improvements.
Replacement Considerations
Consult Infineon's official cross-reference guides for direct substitutes. Consider modules with similar voltage ratings and current capacities if exact matches are unavailable. Ensure replacement parts maintain compatible pinouts and thermal characteristics.
