FS500R17OE4DB61BPSA1

$444.30

Description：FS500R17OE4 - IGBT Module
Series：-

SKU:d992cf30e6ef Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：FS500R17OE4 - IGBT Module
Series：-
Mfr：Infineon Technologies
Package：Bulk
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS500R17OE4DB61BPSA1

Overview

The FS500R17OE4DB61BPSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trench/Fieldstop IGBT4 technology and Emitter Controlled 3 diodes. It features PressFIT connection technology and an integrated NTC temperature sensor. The collector-emitter voltage (VCES) is rated at 1700 V. The continuous DC collector current (IC nom) is 500 A at TC = 95°C, with a maximum of 740 A at TC = 25°C. The repetitive peak collector current (ICRM) reaches 1000 A for 1 ms pulses. The typical collector-emitter saturation voltage (VCE sat) is 1.95 V at Tvj = 25°C. Total power dissipation (Ptot) is 3000 W at TC = 25°C. The operating junction temperature range spans from -40°C to +150°C.

Feature Summary

High short-circuit capability with self-limiting short-circuit current
PressFIT contact technology for robust mechanical mounting
Integrated isolated base plate and NTC temperature sensor

Applications

Auxiliary inverters
High-power converters
Motor drives
Wind turbines

Procurement Notes

Verify the exact ordering suffix against official documentation to confirm specific manufacturing lot or variant details. Ensure compatibility with PressFIT assembly tools and torque specifications during installation. Cross-reference thermal resistance values with your heatsink design requirements to maintain safe operating temperatures under load conditions.

Selection Notes

Select this module for high-current applications requiring robust short-circuit withstand capabilities. Evaluate the thermal resistance parameters against your cooling system design to ensure the junction temperature remains within the specified operational limits. Confirm that the gate drive circuitry supports the required voltage levels and internal gate resistor characteristics for optimal switching performance.

Part Context

This component belongs to the EconoPACK+ series, designed for industrial power electronics. It integrates Trench/Fieldstop IGBT4 technology with Emitter Controlled 3 diodes. The module utilizes PressFIT technology for secure electrical connections without soldering. It includes an integrated NTC thermistor for precise temperature monitoring during operation.