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The FS50R12W1T7PB11BPSA1 is a six-pack IGBT module from Infineon Technologies, utilizing Trenchstop IGBT7 technology. It features a maximum collector-emitter voltage of 1.2 kV and a continuous collector current of 50 A at 25°C. The typical collector-emitter saturation voltage is 1.5 V, with a gate-emitter leakage current of 100 nA. Operating within a temperature range of -40°C to +175°C, the device employs silicon technology. It is housed in an EasyPACK™ 1B package with PressFIT terminals, weighing 24 g.
Verify the specific ordering suffix against the official datasheet to ensure correct configuration. Confirm that the PressFIT termination style matches the target PCB footprint requirements. Check RoHS compliance status as indicated in the product documentation. Ensure thermal interface material selection aligns with the module's heat dissipation specifications for reliable operation under load conditions.
Select this component for applications requiring robust six-pack topology with high voltage blocking capability. The 1.2 kV rating supports medium-voltage industrial systems. Consider the 50 A current capacity relative to thermal management constraints. The IGBT7 generation offers improved efficiency compared to previous technologies. Verify compatibility with standard gate drive voltages and short-circuit withstand times specified in the technical data.
This module belongs to the Trenchstop IGBT7 series, representing advanced silicon power technology from Infineon. It is part of the EasyPACK family, designed for ease of integration into modern power electronics. The six-pack configuration allows for complete three-phase bridge implementations within a single compact unit, reducing system complexity and board space requirements.
Consult official cross-reference lists for direct substitutes. Similar ratings may include variants with different packaging or terminal styles. Verify electrical parameters such as Vceo and Ic before substitution. Ensure thermal characteristics and pinout compatibility are identical to avoid redesign efforts.