ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
FS55MR12W1M1HB11NPSA1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET 6N-CH 1200V 15A AG-EASY1B. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for FS55MR12W1M1HB11NPSA1
- Description：MOSFET 6N-CH 1200V 15A AG-EASY1B
- Series：EasyPACK™, CoolSiC™
- Mfr：Infineon Technologies
- Package：Tray
- Technology：Silicon Carbide (SiC)
- Configuration：6 N-Channel (Full Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：15A (Tj)
- Rds On (Max) @ Id, Vgs：79mOhm @ 15A, 18V
- Vgs(th) (Max) @ Id：5.15V @ 6mA
- Gate Charge (Qg) (Max) @ Vgs：45nC @ 18V
- Input Capacitance (Ciss) (Max) @ Vds：1350pF @ 800V
- Power - Max：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：AG-EASY1B
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for FS55MR12W1M1HB11NPSA1
FET, MOSFET Arrays Overview
The FS55MR12W1M1HB11NPSA1 is a CoolSiC Trench MOSFET half-bridge module in the EasyPACK™ package. It features a 1200 V drain-source voltage and a continuous DC drain current of 15 A at 175 °C, with a repetitive peak current of 30 A. The typical on-state resistance is 79 mΩ at 25 °C. The module integrates an NTC thermistor for thermal monitoring and utilizes PressFIT contact technology.
FET, MOSFET Arrays Feature Summary
- Low inductive design for high-frequency switching applications
- Integrated mounting clamps for rugged mechanical stability
- PressFIT contact technology for reliable electrical connection
- Built-in NTC temperature sensor for thermal management
FET, MOSFET Arrays Applications
- High-frequency switching applications
- DC/DC converters
- Motor drives
- UPS systems
FET, MOSFET Arrays Procurement Notes
Verify that the specific ordering suffix matches the required configuration. Confirm compliance with IEC 60747, 60749, and 60068 standards for industrial application validation. Ensure gate voltage selections align with recommended operating guidelines to maintain long-term device reliability.
FET, MOSFET Arrays Selection Notes
Select this component for designs requiring low switching losses and high power density. Consider the 15 A continuous current rating and 1200 V blocking capability when sizing the system. Evaluate the thermal resistance and integrated NTC sensor requirements for effective heat dissipation and temperature monitoring strategies.
FET, MOSFET Arrays Part Context
This part belongs to Infineon's CoolSiC™ M1H series, utilizing advanced trench MOSFET technology within the EasyPACK™ form factor. The series targets high-efficiency power conversion by leveraging silicon carbide material properties for superior thermal and electrical performance compared to traditional silicon devices.
FET, MOSFET Arrays Replacement Considerations
Consult official documentation for confirmed substitutes. Verify pinout compatibility and electrical ratings before replacing existing components in established designs.
FET, MOSFET Arrays FAQ
What is the maximum operating junction temperature?
The maximum operating junction temperature (Tvj op) is 175 °C.
Does the module include a temperature sensor?
Yes, the module includes an integrated NTC thermistor with a rated resistance of 5 kΩ at 25 °C.
What contact technology does the module use?
The module uses PressFIT contact technology for connecting to the circuit board.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.
