FS600R07A2E3B31BOSA1

FS600R07A2E3B31BOSA1

  • Description:IGBT MODULES
  • Series:*

SKU:cd193aefd35f Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MODULES
  • Series:*
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:-
  • Vce(on) (Max) @ Vge, Ic:-
  • Input:-
  • NTC Thermistor:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):-
  • Current - Collector (Ic) (Max):-
  • Power - Max:-
  • Current - Collector Cutoff (Max):-
  • Input Capacitance (Cies) @ Vce:-

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FS600R07A2E3B31BOSA1

Overview

The FS600R07A2E3B31BOSA1 is a Hybrid Pack 2 IGBT module manufactured by Infineon Technologies. It utilizes silicon technology and features a six-pack configuration. The device supports a maximum collector-emitter voltage of 650 V with a continuous collector current of 600 A at 25°C. The saturation voltage is specified at 1.4 V, while the gate-emitter leakage current is limited to 400 nA. Power dissipation reaches 1.55 kW, and the operating temperature range spans from -40°C to +150°C. The component is designed for through-hole installation.

Feature Summary

  • Six-pack configuration for multi-phase power conversion
  • Hybrid Pack 2 packaging for efficient thermal management
  • Silicon-based TRENCHSTOP technology integration

Applications

  • Industrial motor drives
  • Uninterruptible power supplies
  • Induction heating systems

Procurement Notes

This component is officially listed as End-of-Life (EOL) by the manufacturer. Verification of availability should focus on distributor stock status or obsolescence notifications rather than direct ordering. Confirm specific suffix variations against official discontinuance documents before procurement planning.

Selection Notes

Select this module when a 650 V rating and 600 A current capacity are required in a compact Hybrid Pack 2 form factor. Ensure the application design accommodates the 1.4 V saturation voltage for thermal calculations. Verify that the through-hole mounting style aligns with the target PCB layout requirements.

Part Context

This part belongs to the Infineon Hybrid Pack 2 series, which integrates IGBTs and diodes in a standardized package. It shares family characteristics with other modules in the FSxxxA2E3 series, differing primarily in current ratings and specific electrical parameters defined by the datasheet.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official Infineon replacement guides for end-of-life products to identify compatible alternatives.

FS600R07A2E3B31BOSA1FS600R07A2E3B31BOSA1

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