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Product Detailed Parameters
- Description：MODULE IGBT 600V HYBRID PACK 2
- Series：HybridPACK™ 2
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Phase
- Vce(on) (Max) @ Vge, Ic：1.6V @ 15V, 400A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：650 V
- Current - Collector (Ic) (Max)：530 A
- Power - Max：1250 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：39 nF @ 25 V
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Overview
The FS600R07A2E3BOSA3 is a HybridPACK 2 IGBT module manufactured by Infineon Technologies. It utilizes TRENCHSTOP™ IGBT4 technology with an integrated anti-parallel diode in a half-bridge configuration. The device features a collector-emitter voltage rating of 650 V and a nominal continuous collector current of 600 A at 25°C. Key electrical parameters include a typical saturation voltage of 1.95 V and a forward voltage of 1.8 V for the diode. The module operates within a junction temperature range of -40°C to +150°C and employs solder pins for mounting.
Feature Summary
- Integrates TRENCHSTOP™ IGBT4 technology for optimized switching performance and low conduction losses.
- Features a robust HybridPACK 2 package design suitable for high-power industrial applications.
- Includes an integrated anti-parallel diode to support half-bridge circuit configurations.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific ordering suffix against official documentation, as variations may exist. Confirm component authenticity through authorized channels due to potential counterfeits. Check for end-of-life status or discontinuation notices from the manufacturer before finalizing procurement plans to ensure long-term supply stability.
Selection Notes
Select this module based on its 650 V blocking capability and 600 A current handling capacity. Ensure the thermal management system supports the specified junction temperature limits. Verify that the gate drive requirements align with the IGBT4 technology specifications for optimal switching behavior.
Part Context
This component belongs to Infineon's HybridPACK 2 series, designed for medium to high-power applications. It represents the TRENCHSTOP™ IGBT4 generation, offering improved efficiency compared to previous generations. The module is part of a broader family of silicon-based power modules used in demanding industrial environments.
Replacement Considerations
Consult official replacement guides for direct substitutes. Consider newer generations like TRENCHSTOP™ IGBT5 if available, ensuring pin compatibility and electrical ratings match the original design requirements without modifying the PCB layout.
