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The FS75R07W2E3B11ABOMA1 is a silicon IGBT module manufactured by Infineon Technologies, belonging to the Trenchstop IGBT3 series. It utilizes the EasyPACK trademark packaging and features a six-pack configuration. The device supports a maximum collector-emitter voltage of 650 V and a continuous collector current of 95 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.45 V and a power dissipation rating of 250 W. The module operates within a temperature range from -40°C to +150°C and incorporates an integrated NTC thermistor for thermal monitoring.
Verify the exact part number against official Infineon documentation to ensure compatibility with specific design requirements. Confirm that the ordering suffix matches the intended terminal configuration and material specifications. Cross-reference technical datasheets for accurate thermal and electrical performance data before integration into final assemblies.
Select this component for applications requiring a robust six-pack IGBT solution with integrated thermal sensing. Ensure the system design accommodates the specified 650 V blocking voltage and 95 A current rating. Verify that the PCB layout supports the press-fit mounting method and provides adequate clearance for the EasyPACK form factor.
This module is part of Infineon's Trenchstop IGBT3 product line, which combines high efficiency with reliable performance. The EasyPACK family offers compact dimensions suitable for dense power electronics designs. The six-pack configuration integrates multiple switching elements into a single unit, simplifying assembly and improving system reliability compared to discrete solutions.
Consult official Infineon substitution guides for compatible alternatives. Verify pinout compatibility and electrical parameter equivalence when considering cross-references. Ensure any substitute module meets the same thermal and mechanical constraints required by the original design.