ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：LOW POWER EASY
- Series：*
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：-
- Input：-
- NTC Thermistor：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Power - Max：-
- Current - Collector Cutoff (Max)：-
- Input Capacitance (Cies) @ Vce：-
Download product information
Overview
The FS75R12W2T4PB11BPSA1 is a silicon IGBT module from Infineon Technologies, belonging to the EconoPACK™ 2 series. It features a six-pack configuration with a maximum collector-emitter voltage of 1200 V and a continuous collector current of 75 A at 25°C. The typical saturation voltage is 1.55 V, while the anti-parallel diode forward voltage is 1.72 V. Operating within a junction temperature range of -40°C to +175°C, it utilizes press-fit mounting technology for secure installation.
Feature Summary
- Integrates Trenchstop™ IGBT4 technology for optimized switching performance and low conduction losses.
- Features an integrated NTC thermistor for precise thermal monitoring and protection.
- Utilizes press-fit termination technology to eliminate screw-mounting requirements and reduce assembly stress.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the complete part number against official Infineon documentation to ensure correct suffix identification. Confirm that the specific revision matches project requirements, as ordering suffixes may indicate variations in internal components or packaging without altering core electrical ratings. Cross-reference datasheet SP005147302 for final validation before procurement.
Selection Notes
Select this component for applications requiring robust 1200 V blocking capability and high current density in a compact footprint. The press-fit interface is suitable for designs prioritizing mechanical reliability and simplified assembly processes over traditional screw mounting. Ensure thermal management solutions align with the module's specified operating temperature limits.
Part Context
This module is part of Infineon's EconoPACK™ 2 family, designed for industrial power conversion. It succeeds earlier generations by offering improved power density and reliability through advanced trench gate technology. The six-pack topology integrates three IGBTs and three anti-parallel diodes into a single package for efficient three-phase inverter implementations.
Replacement Considerations
Direct replacements include FS75R12W2T7PB11BPSA1, which offers updated Trenchstop™ 7 technology with similar electrical characteristics but potentially different switching behavior. Designers must verify pin compatibility and thermal interface requirements when substituting between different technology generations within the same package size.
