FS800R07A2E3B31BOSA1

$571.38

Description：IGBT MODULES
Series：*

SKU:da463b57ad18 Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：IGBT MODULES
Series：*
Mfr：Infineon Technologies
Package：Bulk,Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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FS800R07A2E3B31BOSA1

Overview

The FS800R07A2E3B31BOSA1 is a HybridPACK 2 IGBT module manufactured by Infineon Technologies. It features a six-pack configuration with silicon technology. Key electrical parameters include a maximum collector-emitter voltage (VCEO) of 650 V, a continuous collector current of 800 A at 25°C, and a collector-emitter saturation voltage of 1.4 V. The gate-emitter leakage current is specified at 400 nA, with a maximum gate-emitter voltage of 20 V. Power dissipation (Pd) reaches 1.55 kW. The module operates within a temperature range of -40°C to +150°C and utilizes the HybridPack2 through-hole package.

Feature Summary

Utilizes third-generation trench gate/field-stop IGBT3 wafer technology for high current density.
Incorporates PinFin cooling structure supporting direct coolant contact for enhanced thermal cycling capability.
Integrates third-generation emitter-controlled diodes to minimize switching losses.

Applications

Traction inverters for pure electric vehicles
Traction inverters for hybrid electric vehicles

Procurement Notes

Verify component authenticity through authorized distributors or official manufacturer channels due to potential supply chain variations. Confirm RoHS compliance status via the latest datasheet revision. Check for end-of-life notifications as availability may be restricted in certain regions. Ensure storage conditions meet semiconductor handling standards to prevent degradation prior to installation.

Selection Notes

Select this module for applications requiring high power density and robust thermal management in automotive traction systems. Evaluate the 650 V rating against system bus voltages and ensure the 800 A current capacity matches peak load requirements. Consider the HybridPACK 2 package dimensions for mechanical integration and verify compatibility with existing cooling infrastructure designed for direct liquid cooling interfaces.

Part Context

This component belongs to the Infineon HybridPACK 2 family, specifically designed for high-power automotive applications. It represents an evolution in power module design, focusing on increased reliability and power density compared to previous generations. The part number suffix B31 indicates specific packaging and ordering details within the product line.