SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The FS820R08A6P2BBPSA1 is a HybridPACK Drive six-pack IGBT module with EDT2 technology, rated at 750 V and 820 A. It features a direct-cooled PinFin baseplate for superior thermal performance. Key electrical parameters include a collector-emitter saturation voltage of 1.1 V to 1.35 V (at 450 A) and 1.30 V to 1.50 V (at 820 A). The continuous DC collector current is 450 A at 80°C fluid temperature. Total power dissipation reaches 714 W. Thermal resistance from junction to cooling fluid is 0.12 K/W for the IGBT and 0.175 K/W for the diode. The module includes an integrated NTC thermistor with a 5 kΩ resistance at 25°C.
Verify the specific ordering suffix against official Infineon documentation to confirm exact configuration details. Ensure that the required cooling system meets the specified flow rate and pressure drop requirements for optimal thermal performance. Confirm compliance with automotive qualification standards such as AQG324 before finalizing procurement specifications.
Select this module for applications requiring high current density and robust short-circuit ruggedness. Consider the switching frequency range around 10 kHz when designing gate driver circuits. Evaluate the thermal resistance values in conjunction with the expected ambient conditions and coolant flow rates to ensure junction temperatures remain within the operational limits.
This component belongs to the HybridPACK Drive family, which offers scalable power solutions for hybrid and electric vehicle traction inverters. The series covers various voltage and current classes while maintaining a consistent footprint for design flexibility. The FS820R08A6P2B variant specifically targets high-power automotive applications using advanced silicon IGBT technology.
FS820R08A6P2B