FS820R08A6P2BPSA1

Overview

The FS820R08A6P2 is a HybridPACK Drive six-pack power module featuring EDT2 IGBT and diode technology. It offers a collector-emitter voltage (VCES) of 750 V and an implemented collector current (ICN) of 820 A. The continuous DC collector current is 450 A at a baseplate temperature of 80°C with a maximum junction temperature of 175°C. Repetitive peak collector current reaches 1640 A for 1 ms pulses. The module includes an integrated NTC thermistor with a rated resistance of 5.0 kΩ at 25°C. Isolation test voltage is 4.2 kV RMS for 1 second. Stray inductance is limited to 8.0 nH, supporting high switching frequencies around 10 kHz.

Feature Summary

• EDT2 IGBT generation providing benchmark current density and short circuit ruggedness
• Direct cooled PinFin base plate structure for superior thermal characteristics
• Press-fit signal terminals eliminating selective solder processes
• High clearance and creepage distances for increased system working voltages

Applications

• Hybrid Electrical Vehicles (HEV)
• Electric Vehicle (EV) motor drives
• Commercial agriculture vehicles

Procurement Notes

Verify the ordering code SP001499702 matches the required FS820R08A6P2 specification. Confirm the datasheet revision is V3.3 or later to ensure accurate package outline dimensions. Check that the cooling fluid composition aligns with the 50% water and 50% ethylene glycol mixture specified for thermal resistance calculations. Ensure mounting torque values for M4 baseplate screws and EJOT Delta PCB screws are strictly followed during assembly.

Selection Notes

Select this module for applications requiring high power density and robust short-circuit capability. The EDT2 technology optimizes light load losses for real driving cycles. Ensure the system design accommodates the 150°C standard operating junction temperature, with provisions for limiting baseplate temperature if operating up to 175°C. Verify that the gate drive circuit supports the specified internal gate resistor and voltage levels for optimal switching performance.

Part Context

This component belongs to the Infineon HybridPACK Drive family, designed specifically for automotive high-power applications. It utilizes the Micro-Pattern Trench-Field-Stop cell design within the EDT2 IGBT generation. The module integrates six switches into a compact form factor, replacing discrete components to reduce system complexity and improve reliability in electric drive train environments.

Replacement Considerations

Publicly confirmed substitute part numbers are not provided in the official datasheet. Engineers should consult Infineon directly for qualified alternatives or cross-reference options based on specific electrical and mechanical constraints.