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The FS820R08A6P2LMBPSA1 is a HybridPACK Drive IGBT module from Infineon Technologies, utilizing EDT2 technology. It features a six-pack configuration with a maximum collector-emitter voltage of 750 V and a nominal collector current of 820 A. The typical collector-emitter saturation voltage is 1.1 V at 25°C. Designed for automotive applications, it operates within a junction temperature range of -40°C to +150°C. The module employs a PinFin baseplate for direct cooling and includes extended AC power terminals to facilitate phase current sensor integration.
Verify the specific suffix 'LM' indicates extended AC terminals compared to standard variants. Confirm RoHS compliance status through official datasheets. Ensure compatibility with existing cooling systems due to the PinFin design requirements. Check for automotive qualification certifications relevant to the target application environment.
Select this variant when phase current sensing integration is required without additional PCB space constraints. Compare thermal resistance values against system cooling capabilities. Consider the 750 V rating for appropriate voltage headroom in 400V or 800V battery architectures. Evaluate mechanical mounting dimensions for the HybridPACK Drive form factor.
This component belongs to the Infineon HybridPACK Drive series, which targets high-power density automotive traction inverters. The FS820R08A6P2LMBPSA1 is a derivative of the FS820R08A6P2B family, distinguished by its terminal configuration for sensor integration. It represents the EDT2 generation of IGBT modules designed for xEV platforms.
FS820R08A6P2B serves as the base model without extended terminals. FS820R08A6P2LB offers similar extended terminal features. Verify electrical equivalence and mechanical fit before substitution. Consult official replacement guides for pinout compatibility.