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FTCO3V455A1 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET 6N-CH 40V 150A MODULE. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for FTCO3V455A1
- Description：MOSFET 6N-CH 40V 150A MODULE
- Series：SPM®
- Mfr：onsemi
- Package：Tube,Tube
- Technology：MOSFET (Metal Oxide)
- Configuration：6 N-Channel (3-Phase Bridge)
- FET Feature：Logic Level Gate
- Drain to Source Voltage (Vdss)：40V
- Current - Continuous Drain (Id) @ 25°C：150A
- Rds On (Max) @ Id, Vgs：1.66mOhm @ 80A, 10V
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：115W
- Operating Temperature：175°C (TJ)
- Mounting Type：Through Hole
- Package / Case：19-PowerDIP Module
- Supplier Device Package：Module
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for FTCO3V455A1
FET, MOSFET Arrays Overview
The FTCO3V455A1 is a three-phase inverter automotive Smart Power Module (SPM) designed for complete three-phase bridge power stage encapsulation. It utilizes a Direct Bond Copper (DBC) Al2O3 ceramic substrate suitable for heat-sink mounting with thermal interface materials such as grease or graphite. The package body dimensions are 44 mm in length, 29 mm in width, and 5 mm in thickness. An integrated NTC thermistor is included for temperature monitoring.
FET, MOSFET Arrays Feature Summary
- Complete three-phase bridge power stage encapsulated in an epoxy molded package
- Direct Bond Copper (DBC) Al2O3 ceramic substrate for efficient heat dissipation
- Integrated NTC thermistor for thermal management
FET, MOSFET Arrays Applications
- Automotive power modules
- Three-phase inverter systems
FET, MOSFET Arrays Procurement Notes
Verify the component authenticity by checking the manufacturer's official documentation and part markings. Ensure the specific suffix matches the required specifications. Confirm compliance with automotive standards if applicable to the target application environment.
FET, MOSFET Arrays Selection Notes
Select this module when a compact, integrated three-phase inverter solution is required for automotive applications. Consider the physical dimensions of 44x29x5 mm for board space constraints. Ensure adequate thermal management solutions compatible with DBC substrates are available for the operating environment.
FET, MOSFET Arrays Part Context
This component belongs to the family of automotive Smart Power Modules. It integrates power switching elements and control features into a single package to simplify design and improve reliability in high-power automotive electronics compared to discrete component implementations.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.
