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FW216A-TL-2WX is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET. Review the specifications below when checking this part for your BOM.
The FW216A-TL-2WX is a dual-channel N-channel enhancement mode power MOSFET array manufactured by onsemi. It is housed in a compact, high-thermal-performance WDFN-8 package measuring 2x2 mm. The device integrates two matched transistors featuring low on-resistance (RDS(on)). Key electrical specifications include a drain-source voltage rating of 35V and a continuous drain current capacity of 4.5A. This component is designed for applications requiring efficient power switching within small form factors.
Verify the specific ordering suffix to ensure the correct package variant, as the base part number may correspond to different physical footprints such as SOIC-8. Confirm availability status, as this specific model may be discontinued or subject to supply constraints. Cross-reference the datasheet pinout and thermal characteristics against the target PCB layout requirements before finalizing procurement decisions.
Select this component when a dual N-channel configuration is required in a minimal footprint. Ensure the 35V voltage rating and 4.5A current limit align with the system's operational demands. Consider the thermal performance of the WDFN-8 package for heat dissipation needs. Verify compatibility with standard 4.5V drive levels if applicable to the control interface.
This part belongs to the FW216 series of power MOSFET arrays from onsemi. It shares architectural similarities with other devices in the lineup but is distinguished by its specific voltage ratings, current capabilities, and package type. The series targets portable and space-constrained electronic designs requiring reliable power switching solutions.
The FW216A-TL-2W is listed as a related variant with an SOIC-8 package. Direct substitution requires verification of pinout compatibility and thermal resistance differences between the WDFN-8 and SOIC-8 packages. Evaluate PCB rework feasibility due to the package change.
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