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Product Detailed Parameters
- Description：IGBT MOD 3300V 1500A 9800W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray,Tray
- IGBT Type：-
- Configuration：-
- Vce(on) (Max) @ Vge, Ic：3.65V @ 15V, 800A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 125°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：3300 V
- Current - Collector (Ic) (Max)：1500 A
- Power - Max：9800 W
- Current - Collector Cutoff (Max)：5 mA
- Input Capacitance (Cies) @ Vce：97 nF @ 25 V
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Overview
The FZ800R33KL2CNOSA1 is a silicon IGBT power module from Infineon Technologies, belonging to the EasyPacK 2B series. It features a dual configuration with a maximum collector-emitter voltage (Vceo) of 3300 V and a continuous collector current (Ic) of 800 A at 25°C. The module utilizes Trenchstop technology for optimized switching performance. Key electrical parameters include a saturation voltage (Vce(sat)) typically around 2.55 V at rated conditions. It is designed for baseplate mounting and operates within a junction temperature range of -40°C to +150°C.
Feature Summary
- Dual IGBT configuration within a compact modular housing
- Trenchstop technology for enhanced switching efficiency
- High voltage capability suitable for industrial traction and renewable energy systems
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Wind turbine converters
Procurement Notes
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and specific ordering suffixes against official datasheets. Check for obsolescence notices as this part may be subject to lifecycle changes. Ensure proper handling procedures are followed due to high-power semiconductor sensitivity.
Selection Notes
Evaluate thermal management requirements based on the specified junction temperature limits. Compare saturation voltage and switching losses against system efficiency targets. Verify mechanical compatibility with existing cooling solutions and mounting structures. Consider derating factors for ambient temperature and altitude when determining operational margins.
Part Context
This module is part of Infineon's EasyPacK 2B family, which offers flexible pin grid systems for custom layouts. It serves as a high-power solution bridging smaller modules and larger hybrid packs. The series is engineered for reliability in demanding industrial environments, providing a balance between performance density and design flexibility for engineers developing robust power electronics.
Replacement Considerations
Direct substitutes should be sought within the same EasyPacK 2B family or compatible Trenchstop series modules with matching voltage and current ratings. Verify pinout compatibility and thermal characteristics before substitution. Cross-reference with updated Infineon replacement guides for discontinued parts.
