GA400TD25S

$125.65

Description：IGBT MOD 250V 400A INT-A-PAK
Series：-

SKU:9f74737aea6c Category: IGBT Modules Brand: Vishay General Semiconductor - Diodes Division

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Product introduction

Product Detailed Parameters

Description：IGBT MOD 250V 400A INT-A-PAK
Series：-
Mfr：Vishay General Semiconductor - Diodes Division
Package：Tube
IGBT Type：-
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：1.6V @ 15V, 400A
Input：Standard
NTC Thermistor：No
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：Dual INT-A-PAK (3 + 8)
Supplier Device Package：Dual INT-A-PAK
Voltage - Collector Emitter Breakdown (Max)：250 V
Current - Collector (Ic) (Max)：400 A
Power - Max：1350 W
Current - Collector Cutoff (Max)：500 µA
Input Capacitance (Cies) @ Vce：36 nF @ 30 V

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GA400TD25S

Overview

The GA400TD25S is a dual IGBT module from the GA400TDxxS series, manufactured by Vishay Semiconductors. It features a Dual INT-A-Pak package with SMD/SMT mounting style. The device has a maximum collector-to-emitter voltage (VCEO) of 250 V and a continuous collector current of 400 A at 25°C. The junction-to-case thermal resistance is 0.09 °C/W for the IGBT and 0.20 °C/W for the diode. Operating temperature ranges from -40°C to +150°C. The gate-to-emitter maximum voltage is ±20 V. The module utilizes Silicon technology.

Feature Summary

Standard speed IGBT optimized for minimum saturation voltage and operating frequencies up to 10kHz
HEXFRED antiparallel diodes with ultra-soft recovery characteristics
Generation 4 IGBT technology providing very low conduction and switching losses
Industry standard package design allowing direct mounting to heatsink

Applications

Uninterruptible Power Supplies (UPS)
Switched Mode Power Supplies (SMPS)
Welding equipment

Procurement Notes

Verify component authenticity through authorized distributors or official manufacturer channels. Confirm RoHS compliance status as indicated in product documentation. Check for specific ordering suffixes that may affect packaging or electrical parameters. Ensure storage conditions remain within specified limits prior to installation.

Selection Notes

Evaluate thermal management requirements based on junction-to-case resistance values. Consider gate drive compatibility with specified threshold voltages and total gate charge. Assess system voltage levels against the 250 V collector-to-emitter rating. Verify mechanical fit within the Dual INT-A-Pak footprint constraints.

Part Context

This component belongs to the GA400TDxxS series of dual IGBT modules. It represents Generation 4 technology designed for industrial power conversion applications. The module integrates standard speed IGBTs with HEXFRED antiparallel diodes in a single package structure.