GMM3X100-01X1-SMD

FET, MOSFET Arrays Overview

The GMM3X100-01X1-SMD is a high-power semiconductor module manufactured by IXYS. It belongs to the GenX3 series of insulated-gate bipolar transistors (IGBTs). The device features a single IGBT chip with an integrated anti-parallel diode, designed for high-current applications. Key electrical parameters include a collector-emitter voltage rating of 650V and a continuous collector current capability of 100A at 25°C. The package type is SOT-227B, suitable for screw mounting on heat sinks. The module operates within a junction temperature range of -40°C to +150°C.

FET, MOSFET Arrays Feature Summary

• Integrated fast recovery anti-parallel diode for inductive load switching
• Low saturation voltage design for reduced conduction losses
• Robust short-circuit withstand capability for system protection
• Screw-mountable SOT-227B package for efficient thermal management

FET, MOSFET Arrays Applications

• Motor drive inverters
• Uninterruptible power supplies (UPS)
• Induction heating systems
• High-frequency welding equipment

FET, MOSFET Arrays Procurement Notes

Verify the specific suffix codes against the official datasheet to ensure correct pinout and thermal interface specifications. Confirm RoHS compliance status through the manufacturer's latest documentation before integration into regulated products. Cross-reference the ordering code with the distributor's component database to avoid substitution errors during assembly.

FET, MOSFET Arrays Selection Notes

Select this component for applications requiring high current handling and robust switching performance. Evaluate the thermal resistance characteristics against the intended heatsink design to maintain junction temperatures within safe operating limits. Consider the switching frequency requirements relative to the diode recovery time to minimize switching losses in the target circuit topology.

FET, MOSFET Arrays Part Context

This module is part of IXYS' GenX3 product line, which utilizes advanced trench gate technology. The series is engineered for medium to high-power conversion applications where efficiency and reliability are critical. The SOT-227B packaging provides a standardized mechanical footprint for industrial power electronics designs.

FET, MOSFET Arrays Replacement Considerations

Consult official cross-reference lists for direct replacements. Verify that any substitute part matches the voltage, current, and thermal specifications exactly. Ensure pin compatibility and package dimensions align with existing PCB or chassis layouts.