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The SemiQ GSXD080A018S1-D3 is a Schottky diode array housed in a SOT-227-4 (miniBLOC) chassis mount package. It features two independent diodes with a maximum repetitive peak reverse voltage of 180 V and an average forward rectified current rating of 80 A. The component utilizes Silicon Carbide (SiC) technology to achieve fast recovery characteristics, specifically defined as less than or equal to 500 ns. Designed for high-power applications, it supports a maximum operating junction temperature of +175 °C and complies with RoHS standards.
Verify the specific datasheet version when sourcing, as manufacturer documentation may update thermal resistance values or pinout definitions over time. Confirm that the procurement channel provides original components with traceable manufacturing lot codes. Ensure the receiving facility has appropriate ESD protection protocols, as semiconductor devices are sensitive to electrostatic discharge during handling and storage.
Select this component for designs requiring high current density and low forward voltage drop at elevated temperatures. The SOT-227-4 package facilitates efficient heat dissipation through direct chassis mounting. Consider the 180 V reverse voltage rating relative to the system's peak transient voltages to ensure adequate safety margins against breakdown events in the target application circuit.
This part belongs to the SemiQ GSXD series of silicon carbide Schottky diode arrays. The series is characterized by robust packaging designed for industrial environments. The specific model designation indicates the electrical ratings and package type, distinguishing it from other variants in the lineup that may offer different voltage or current specifications while maintaining similar thermal management capabilities.
Direct substitutes include the GSXD080A010S1-D3 and GSXD080A018S1-D3 from the same manufacturer family. Verify that any alternative component matches the 80 A current rating and 180 V reverse voltage requirements. Ensure the replacement maintains the SOT-227-4 footprint and identical pin configuration to avoid PCB redesign.