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HCDP68HC68T1M is listed in the Telecom range at ChipApex. The manufacturer field lists Harris Corporation. Its product description is HCDP68HC68T1M. Review the specifications below when checking this part for your BOM.
The HCDP68HC68T1M is a Real-Time Clock (RTC) integrated circuit manufactured by Harris Corporation, belonging to the CDP68HC68 family. It functions as a clock/calendar device with an SPI interface and includes 32 bytes of static RAM for data storage. The component operates within a supply voltage range of 3V to 6V and supports battery backup voltages from 2.2V to 6V. It features alarm capabilities, leap year compensation, square wave output, and a watchdog timer. The device is designed for industrial temperature ranges and utilizes a surface-mount package format.
Verify the manufacturer origin carefully, as Harris Corporation's semiconductor assets were acquired by Renesas Electronics. Ensure the specific suffix matches the required package type and temperature grade. Confirm RoHS compliance status and check for obsolescence notices or last-time-buy dates before finalizing procurement plans.
Select this component when an SPI-connected RTC with integrated memory is required. Compare against other CDP68HC68 variants based on package style (SOIC vs. DIP) and operating temperature range. Verify that the 32-byte RAM capacity meets application data storage needs and that the SPI interface speed is compatible with the host microcontroller.
This part belongs to the CDP68HC68 series of real-time clock ICs originally developed by Harris Semiconductor. The series provides standalone timekeeping solutions with varying package options and memory configurations. Following corporate acquisitions, these parts are often referenced under Renesas Electronics product lines, maintaining functional compatibility with original specifications.
Check for direct pin-compatible replacements within the CDP68HC68 family, such as the CDP68HC68T1MZ. Verify if newer generations from Renesas offer equivalent SPI interfaces and RAM sizes. Ensure any substitute maintains the same voltage levels and package dimensions for board-level integration.
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