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HMC453QS16GETR
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Product Detailed Parameters
- Description：IC AMP CDMA 400MHZ-2.2GHZ 16QSOP
- Series：-
- Mfr：Hittite
- Package：Bulk
- Frequency：400MHz ~ 2.2GHz
- P1dB：32.5dBm
- Gain：20.5dB
- Noise Figure：9dB
- RF Type：CDMA, GSM, WCDMA
- Voltage - Supply：5V
- Current - Supply：725mA
- Test Frequency：400MHz
- Mounting Type：Surface Mount
- Package / Case：16-SSOP (0.154", 3.90mm Width) Exposed Pad
- Supplier Device Package：16-QSOP-EP
- Grade：-
- Qualification：-
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Overview
The HMC453QS16GETR is a GaAs MMIC RF power amplifier designed for CDMA applications. It operates within a frequency range of 400 MHz to 2.2 GHz. The device provides a typical gain of 20.5 dB and delivers an output power of 32.5 dBm at the 1 dB compression point (P1dB). It supports an output power level of 1.6 Watts in surface-mount technology. The component utilizes a 16-lead QSOP package, suitable for compact wireless infrastructure designs.
Feature Summary
- Integrated GaAs MMIC technology for high-performance RF amplification
- Optimized for CDMA signal processing requirements
- High linearity with significant output power capability
- Compact surface-mount packaging for space-constrained layouts
Applications
- CDMA base station transmitters
- Wireless infrastructure power amplification
- Broadband RF signal boosting
- Mobile communication system uplinks
Procurement Notes
Verify manufacturer authenticity through Analog Devices or authorized distributors. Confirm lot traceability and RoHS compliance status. Ensure storage conditions meet moisture sensitivity levels. Validate part marking against official datasheet specifications. Request test reports for critical performance metrics before integration.
Selection Notes
Evaluate thermal management requirements due to high output power. Consider impedance matching networks for optimal gain flatness across the 400 MHz to 2.2 GHz band. Assess bias voltage stability for consistent P1dB performance. Compare noise figure specifications against system sensitivity needs. Verify package compatibility with existing PCB footprints.
Part Context
This component belongs to the Hittite Microwave Corporation portfolio, now integrated into Analog Devices. It represents a specialized RF solution for cellular communication systems. The QSOP package variant ensures reliable surface-mount assembly. The device targets high-volume production environments requiring stable RF performance.
Replacement Considerations
No public confirmed substitute part numbers are available in the provided documentation. Cross-referencing requires detailed electrical parameter matching. Consult manufacturer engineering support for qualified alternatives.
