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Product Detailed Parameters
- Description:IC AMP GPS 400MHZ-2.2GHZ SOT89
- Series:-
- Mfr:Analog Devices Inc.
- Package:Strip
- Frequency:400MHz ~ 2.2GHz
- P1dB:32.5dBm
- Gain:7.5dB
- Noise Figure:6.5dB
- RF Type:General Purpose
- Voltage - Supply:5V
- Current - Supply:725mA
- Test Frequency:2.11GHz
- Mounting Type:Surface Mount
- Package / Case:TO-243AA
- Supplier Device Package:SOT-89
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Overview
The HMC453ST89E is a high dynamic range GaAs InGaP HBT MMIC power amplifier operating from 0.4 to 2.2 GHz. It delivers 1.6 Watts of output power with a gain of 21 dB and a noise figure of 4.5 dB. The device features a P1dB compression point of 21 dBm and an OIP3 of 33 dBm. It operates on a supply voltage of 5 V with a current consumption of 82 mA. Packaged in SOT-89, it supports surface mount installation.
Feature Summary
- High dynamic range performance utilizing GaAs InGaP HBT technology
- Integrated monolithic microwave integrated circuit (MMIC) design for compact implementation
- Optimized for high output IP3 and power-added efficiency
Applications
- Cellular base station power amplification
- PCS band signal processing
- 3G network infrastructure components
Procurement Notes
Verify component authenticity through authorized distribution channels due to discontinuation status. Confirm package integrity and pin alignment against the SOT-89 specification prior to assembly. Review the official EOL documentation for final purchase timing constraints and substitute part availability.
Selection Notes
Select this component for applications requiring 1.6 W output power within the 0.4 to 2.2 GHz frequency range. Ensure thermal management strategies accommodate the specified power dissipation levels. Validate that the 5 V supply voltage aligns with system power architecture requirements.
Part Context
This part belongs to the HMC series of RF amplifiers manufactured by Analog Devices Inc. It represents a legacy product line previously associated with Hittite Microwave Corporation before acquisition. The SOT-89 packaging provides a standard footprint for surface mount integration in wireless communication systems.
Replacement Considerations
- HMC453ST89
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