HSMP-3824-TR1G

RF Diode Overview

The HSMP-3824-TR1G is a surface mount RF PIN diode from the Broadcom HSMP-382x series, housed in an SOT-23 package. It features a common cathode configuration with a peak inverse voltage of 50 V and a maximum series resistance of 0.6 Ω at 10 mA forward current. The device exhibits a total capacitance of 0.8 pF at 1 MHz and operates within a temperature range of -65°C to +150°C. Designed for low current switching and low distortion attenuation, it supports frequencies up to 3 GHz.

RF Diode Feature Summary

• Optimized for ultra-low resistance switching applications
• Suitable for power limiting and circuit protection
• Lead-free construction with low failure rate

RF Diode Applications

• RF switching circuits requiring low insertion loss
• Low distortion attenuating systems
• Power limiting and circuit protection

RF Diode Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for obsolescence notices prior to procurement. Ensure storage conditions adhere to specified temperature limits to maintain device integrity during handling and assembly processes.

RF Diode Selection Notes

Select this component for designs requiring common cathode PIN diode configurations in SOT-23 packages. Evaluate thermal resistance and junction temperature limits against expected operating conditions. Consider carrier lifetime and reverse recovery time specifications when designing high-frequency switching or limiting circuits.

RF Diode Part Context

This part belongs to the HSMP-382x series of surface mount RF PIN diodes manufactured by Broadcom Limited. The series includes various configurations such as single, series, common anode, and dual anode variants. The HSMP-3824 specifically provides a common cathode option optimized for low current switching and low distortion attenuation applications.

RF Diode Replacement Considerations

Check datasheets for equivalent parts offering similar breakdown voltage, series resistance, and capacitance values. Verify package compatibility and pinout alignment before substitution. Ensure replacement components meet the same thermal and frequency performance requirements.