HSMP-386B-TR2G

RF Diode Overview

The HSMP-386B-TR2G is a surface mount PIN diode manufactured by Broadcom Limited, housed in an SOT-23 package. It features a single diode configuration with a breakdown voltage of 50 V and a typical total capacitance of 0.20 pF at 1 MHz. The series resistance is typically 1.5 Ω at 100 MHz. Operating temperatures range from -65°C to +150°C, with a maximum forward current of 1 A under pulse conditions.

RF Diode Feature Summary

• Designed for low distortion switching applications requiring minimal capacitance
• Optimized for attenuator circuits where low current consumption is critical
• Utilizes matched diodes to ensure consistent performance across configurations

RF Diode Applications

• Low distortion RF switches
• Current-sensitive attenuators
• High isolation SPDT switch circuits

RF Diode Procurement Notes

Verify the specific ordering suffix to confirm packaging quantity and type. The TR2G suffix indicates tape and reel packaging containing 10,000 devices per 13-inch reel. Confirm RoHS compliance status and lead-free assembly requirements prior to procurement to ensure compatibility with manufacturing processes.

RF Diode Selection Notes

Select this component when board space is limited and low capacitance is required for high-frequency switching. Ensure the design accommodates the 50 V peak inverse voltage rating. Verify that the thermal resistance characteristics of the SOT-23 package align with the expected power dissipation levels in the target application environment.

RF Diode Part Context

This part belongs to the HSMP-386x series of general-purpose silicon PIN diodes. The series offers various configurations including single, series, common anode, common cathode, and unconnected trio options within surface mount packages like SOT-23, SOT-323, and SOT-363.

RF Diode Replacement Considerations

Direct substitutes include other parts within the HSMP-386x family sharing the same electrical profile and package, such as HSMP-3860 or HSMP-386A variants. Verify pinout compatibility and physical dimensions before substitution.