HSP50214AVC

HSP50214AVC

$28.15
  • Description:PROGRAMMABLE DOWNCONVERTER
  • Series:-
  • Mfr:Harris Corporation
  • Package:Bulk

SKU:3f032ef5a33e Category: Brand:

  
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Product Detailed Parameters

  • Description:PROGRAMMABLE DOWNCONVERTER
  • Series:-
  • Mfr:Harris Corporation
  • Package:Bulk
  • Function:Downconverter
  • Frequency:-
  • RF Type:AMPS, CDMA, GSM, NA TDMA
  • Secondary Attributes:Down Converter
  • Mounting Type:Surface Mount
  • Package / Case:120-BQFP
  • Supplier Device Package:120-MQFP (28x28)
  • Grade:-
  • Qualification:-

Download product information

HSP50214AVC

Overview

The HSP50214AVC is a programmable downconverter manufactured by Harris Corporation. It is designed for RF applications including AMPS, CDMA, GSM, and NA TDMA systems. The component functions as a downconverter to facilitate signal processing in telecommunications infrastructure. It is housed in a 120-BQFP surface-mount package with dimensions of 28x28 mm. The device is currently active and available from distributors such as Rochester Electronics.

Feature Summary

  • Programmable architecture allows for flexible configuration in various telecommunication standards.
  • Integrated downconversion capability supports direct signal frequency translation.
  • Surface-mount packaging facilitates automated assembly and compact board integration.

Applications

  • AMPS cellular network base stations
  • CDMA communication systems
  • GSM mobile infrastructure

Procurement Notes

Verify the specific suffix 'AVC' against official Harris Corporation documentation to confirm pinout and electrical characteristics match your design requirements. Ensure compliance with RoHS status if applicable, as older components may not meet current environmental regulations. Confirm availability through authorized distributors like Rochester Electronics, noting that lead times may vary based on stock levels.

Selection Notes

Select this component when designing systems requiring programmable downconversion for legacy or specific regional standards like NA TDMA. Consider the 120-BQFP package size for PCB layout constraints. Evaluate thermal management needs due to the dense package. Compare against newer integrated solutions if power consumption or size are critical factors, ensuring the selected part meets all interface and performance specifications.

Part Context

Harris Corporation specialized in communications and information technology before its acquisition. This component belongs to their RF IC portfolio, targeting wireless infrastructure. The HSP series typically includes high-performance analog and mixed-signal devices. Understanding the company's history helps contextualize the component's age and potential obsolescence status in modern supply chains.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Engineers should consult Harris Corporation archives or authorized distributors for cross-reference data. Verify compatibility with existing firmware and hardware interfaces before considering alternative vendors.

FAQ

What RF types does the HSP50214AVC support?

It supports AMPS, CDMA, GSM, and NA TDMA radio frequency types.

What is the package type for this component?

The component uses a 120-BQFP surface-mount package.

HSP50214AVCHSP50214AVC
$28.15
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