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HUF75637S3 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is MOSFET N-CH 100V 44A D2PAK. Review the specifications below when checking this part for your BOM.
The HUF75637S3 is an N-channel Power MOSFET manufactured by Fairchild Semiconductor, belonging to the UltraFET family. It features a 100V drain-source voltage rating and a continuous drain current capacity of 44A at case temperature. The device exhibits a maximum on-resistance of 30 milliohms at a gate-source voltage of 10V. Designed for surface-mount applications, it utilizes a TO-252AA (DPAK) package with a thermal resistance optimized for high-power dissipation up to 64W. The component supports an operating junction temperature range from -55°C to +175°C.
Verify the manufacturer designation carefully, as Fairchild Semiconductor's discrete semiconductor division has undergone corporate restructuring and brand transitions. Confirm that the specific part number corresponds to the original Fairchild production specifications rather than subsequent iterations under different branding entities. Ensure compliance with RoHS directives and lead-free requirements applicable to the specific manufacturing lot date code.
Select this component when a surface-mount solution is required for medium-power switching applications demanding low conduction losses. The TO-252AA package offers a balance between current handling capability and board space efficiency compared to through-hole alternatives. Evaluate thermal management requirements based on the 64W power dissipation rating and ensure adequate copper area for heat sinking to maintain junction temperatures within safe operating limits during continuous operation.
This device is part of the UltraFET series, which integrates advanced cell architecture to minimize on-resistance while maintaining robust avalanche characteristics. The HUF75637S3 variant specifically adapts the standard TO-220 footprint into a surface-mount form factor, facilitating modern PCB designs without sacrificing the electrical performance associated with larger packages.
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