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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The IFF300B12N2E4P_B11 is a MIPAQ base module integrating Trench/Fieldstop IGBT4 and an Emitter Controlled Diode. It features PressFIT terminals and pre-applied thermal interface material. The collector-emitter voltage (VCES) is 1200 V, with a continuous DC collector current (IC nom) of 300 A at TH = 30°C and a repetitive peak collector current (ICRM) of 600 A. The saturation voltage (VCEsat) ranges from 1.75 V to 2.10 V depending on junction temperature. Thermal resistance from junction to heatsink is 0.190 K/W for the IGBT and 0.296 K/W for the diode.
Verify the exact ordering suffix against official Infineon documentation to ensure correct terminal technology and thermal interface specifications. Confirm that the component matches the required electrical ratings and mechanical dimensions for your specific inverter design before finalizing procurement.
Select this module for applications requiring high robustness under thermal cycling conditions. Ensure the gate drive circuit supports the specified VGE range and internal gate resistor values. Verify that the system's stray inductance remains within limits to maintain safe operating area compliance during switching events.
This component belongs to the MIPAQ base module family, designed for industrial power conversion. It utilizes Infineon's Trench/Fieldstop IGBT4 technology combined with an Emitter Controlled Diode to optimize switching losses and conduction characteristics for medium-power inverter applications.
Publicly confirmed substitute part numbers are not available in the provided datasheet. Consult official Infineon resources or authorized distributors for cross-reference information regarding compatible modules with similar electrical and mechanical specifications.
The maximum baseplate operation temperature (TBPmax) is 125 °C.
Yes, the module comes with pre-applied thermal interface material.
The isolation test voltage (VISOL) is 2.5 kV RMS at 50 Hz for 1 minute.