IFS100V12PT4BOSA1

Overview

The IFS100V12PT4BOSA1 is a six-pack power module utilizing IGBT4 technology, rated for 1200 V and 100 A. It integrates isolated gate drivers, protection circuits, and temperature sensors within the MIPAQ serve package. The module features a B6I topology with an operating junction temperature up to 150°C. Key electrical parameters include a collector-emitter saturation voltage of 1.75 V at 25°C and 2.15 V at 150°C. Switching losses are specified as 10.2 mJ for turn-on and 8.0 mJ for turn-off at 600 V DC link and 100 A. Thermal resistance from junction to case is 0.3 K/W for IGBTs and 0.55 K/W for diodes.

Feature Summary

• Integrated isolated IGBT driver with short circuit and undervoltage lockout protection
• Built-in digital temperature sensor providing frequency-based output data
• Galvanic isolation between logic and power sides compliant with IEC61800-5-1 standards

Applications

• Industrial motor drives
• Uninterruptible Power Supply (UPS) systems
• Solar inverters
• Auxiliary inverters

Procurement Notes

Verify the specific ordering suffix BOSA1 against official Infineon documentation to confirm packaging and reel specifications. Ensure compatibility with Molex Microfit and Milligrid connectors referenced in application notes. Confirm that the component meets RoHS and UL94 requirements for the intended industrial environment before finalizing procurement orders.

Selection Notes

Select this module for applications requiring integrated drive and protection in a six-pack configuration. Evaluate thermal management based on the 0.3 K/W junction-to-case resistance. Ensure the control interface supports the required 5V-CMOS logic levels and that the switching frequency remains within the 20 kHz limit defined in the datasheet specifications.

Part Context

This component belongs to the MIPAQ serve series, designed for high-power density applications. It combines IGBT4 semiconductor technology with embedded electronics to simplify system design. The module provides a complete solution for three-phase bridge legs by integrating all necessary gate drive functions directly onto the power module substrate.

Replacement Considerations

Direct substitutes must match the 1200V/100A rating, six-pack topology, and integrated driver architecture. Verify pinout compatibility with existing Molex connectors. Check if alternative modules offer similar stray inductance values and isolation voltages to ensure seamless integration without redesigning the control board or cooling system.