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The IGC39T65QEX1SA1 is a single Insulated Gate Bipolar Transistor (IGBT) die manufactured by Infineon Technologies. It utilizes Trench Field Stop technology with a 650V voltage rating and supports a continuous collector current of 75A. The component features low saturation voltage (VCE(sat)) and low turn-off losses, contributing to high energy efficiency. Mechanical specifications include a die size of 6.59 mm x 5.91 mm and a total area of 38.95 mm². It is designed for power electronic applications requiring high-speed switching and low electromagnetic interference.
Verify the specific ordering suffix against official Infineon documentation to ensure correct technical configuration. Confirm that the device is supplied as a bare die rather than a packaged module. Check RoHS compliance status and mechanical dimensions against project requirements before procurement.
Select this component for applications requiring a 650V rated IGBT die with high current handling capabilities. Consider the mechanical footprint and thermal management requirements associated with bare die mounting. Ensure gate drive circuitry supports the fast switching characteristics inherent to Trench Field Stop technology.
This component belongs to Infineon's IGBT discrete series, which combines advanced semiconductor technology with reliability for superior energy efficiency. The IGC39T65QE series represents high-performance solutions designed for diverse industrial and commercial power applications.
Public confirmed substitute part numbers are not available in the provided documentation.