IM241L6S1BAUMA1

Overview

The IM241L6S1BAUMA1 is a CIPOS Micro intelligent power module featuring a 600 V reverse conducting IGBT and integrated gate drivers. It utilizes a SOP 29x12 surface mount package with 23 pins. The device supports a DC link supply voltage up to 400 V, with a maximum collector current of ±6 A at 25°C case temperature. Operating junction temperature ranges from -40°C to 150°C, while the operating case temperature spans -40°C to 125°C. Power dissipation per IGBT is rated at 12 W. The module includes an internal NTC thermistor for thermal monitoring and provides isolated 2000 VRMS protection.

Feature Summary

• Integrates 600 V reverse conducting IGBTs with industry-benchmarked half-bridge drivers for optimized PCB size and system costs.
• Includes comprehensive protection features such as precise overcurrent shutdown via ITRIP, programmable fault clear timers, and undervoltage lockout.
• Features low-side emitter pins accessible for individual phase current monitoring in an open emitter configuration.
• Provides built-in bootstrap functionality and advanced input filtering with shoot-through prevention capabilities.

Applications

• High-efficiency appliance motor drives
• Fan and pump control systems
• Small home appliances

Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm the SOP 29x12 surface mount package type and fast speed version designation. Ensure compliance with industrial application standards and JEDEC qualification requirements before integration into final designs.

Selection Notes

Select this component for applications requiring high switching speeds and low conduction losses within the CIPOS Micro family. Consider the 600 V blocking capability and ±6 A current rating when designing for 300 V to 400 V DC bus voltages. Verify that the thermal management strategy accommodates the specified junction-to-case thermal resistance values.

Part Context

This part belongs to the CIPOS Micro IM241 product group, which integrates various power and control components to increase reliability. The series offers both surface mount (SOP) and through-hole (DIP) configurations, designed specifically for optimizing system costs and PCB footprint in motor drive applications.

Replacement Considerations

The IM241-L6T2B serves as the through-hole equivalent within the same datasheet specification. Other variants in the IM241-S6S1B or IM241-M6S1B families offer different current ratings but share similar architectural features.