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IMZA75R060M1HXKSA1 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is SILICON CARBIDE MOSFET. Review the specifications below when checking this part for your BOM.
The IMZA75R060M1HXKSA1 is a CoolSiC™ Power Device 750 V G1 N-channel MOSFET in a PG-TO247-4 package. It features a drain-source voltage (VDSS) of 750 V, typical on-state resistance (RDS(on)) of 60 mΩ at VGS=18V, and maximum RDS(on) of 78 mΩ. The continuous DC drain current (IDDC) is 32 A at TC=25°C. Total gate charge (QG) is typically 23 nC. Peak drain current (IDM) reaches 89 A. Operating junction temperature ranges from -55°C to +175°C. Thermal resistance junction-to-case (Rth(j-c)) is 1.04 °C/W.
Verify the component status as NRND (Not Recommended for New Designs) before procurement. Confirm that the source and driver source pins are not exchangeable to prevent malfunction. Ensure compliance with JEDEC qualification standards for industrial applications. Check for specific RoHS details if required by your manufacturing process.
Select this device for high-temperature and harsh operation environments requiring simplified deployment of high system efficiency. Consider its suitability for bus voltages beyond 500 V where enhanced robustness is critical. Evaluate its performance in hard switching for superior efficiency or soft switching topologies for higher frequencies.
This component belongs to the Infineon CoolSiC™ 750 V G1 family. It utilizes silicon carbide material characteristics developed over more than 20 years. The device is fully qualified according to JEDEC for industrial applications. It represents a solid silicon carbide technology offering a unique combination of performance, reliability, and ease of use.
IMZA75R060M1HXTMA1 is a tape-and-reel version of the same die and specifications within the PG-TO247-4 package. Verify pinout compatibility and thermal characteristics when substituting packaging types.
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