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IRAM336-025SB3 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC HYBRID MULTI-CHIP 500V 2A. Review the specifications below when checking this part for your BOM.
The IRAM336-025SB is a multi-chip Hybrid IC designed for low-power appliance motor control. It integrates three-phase high-voltage MOSFETs with an industry benchmark HVIC driver compatible with 3.3V and 5V logic inputs. The device features built-in protection mechanisms including temperature feedback, shoot-through prevention, under-voltage lockout, and shutdown input. Internal bootstrap diodes eliminate the need for isolated power supplies, reducing component count. The SIP-S package minimizes PCB space while providing thermal enhancement.
Verify datasheet revision (PD-97277 Rev A) and manufacturer origin (Infineon/International Rectifier). Confirm pin-out compatibility with existing designs. Ensure thermal management meets case temperature limits (-20 to +100°C). Validate logic voltage levels against system requirements.
Select based on required RMS phase current and PWM switching frequency. Consider thermal resistance and maximum junction temperature (+150°C). Evaluate internal thermistor characteristics for temperature monitoring. Check bootstrap capacitor requirements based on operating frequency.
Part of the IRAM336 series of integrated power hybrid ICs. Designed specifically for appliance motor drive applications requiring compact solutions. Combines power MOSFETs with advanced driver circuitry in a single module.
Check for direct substitutes within the IRAM336 series or similar Infineon hybrid modules. Verify pin compatibility and electrical specifications before substitution.
It uses internal bootstrap diodes to generate bootstrapped power supplies for the high-side drivers, eliminating the need for isolated power supplies.
The integrated HVIC driver is compatible with both 3.3V and 5V input logic levels.
No, the case is connected to the negative DC bus and is not isolated. Isolation material between the case and heat sink is recommended.
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