Power Driver Modules IRAM336-025SB3 product image

IRAM336-025SB3

$7.33
  • Description:IC HYBRID MULTI-CHIP 500V 2A
  • Series:-

SKU:3a4bb84bc6b4 Category: Brand:

  
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IRAM336-025SB3 is listed in the Power Driver Modules range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC HYBRID MULTI-CHIP 500V 2A. Review the specifications below when checking this part for your BOM.

Power Driver Modules specifications for IRAM336-025SB3

  • Description:IC HYBRID MULTI-CHIP 500V 2A
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tube
  • Type:MOSFET
  • Configuration:3 Phase
  • Current:2:00 AM
  • Voltage:500 V
  • Voltage - Isolation:-
  • Mounting Type:Through Hole
  • Package / Case:19-PowerSSIP Module, Formed Leads
  • Grade:-
  • Qualification:-

Power Driver Modules datasheet and documents for IRAM336-025SB3

IRAM336-025SB3

Power Driver Modules Overview

The IRAM336-025SB is a multi-chip Hybrid IC designed for low-power appliance motor control. It integrates three-phase high-voltage MOSFETs with an industry benchmark HVIC driver compatible with 3.3V and 5V logic inputs. The device features built-in protection mechanisms including temperature feedback, shoot-through prevention, under-voltage lockout, and shutdown input. Internal bootstrap diodes eliminate the need for isolated power supplies, reducing component count. The SIP-S package minimizes PCB space while providing thermal enhancement.

Power Driver Modules Feature Summary

  • Integrated gate drivers and internal bootstrap diodes
  • Over-current shut-down function
  • Under-voltage lockout for all switches
  • Cross-conduction prevention logic

Power Driver Modules Applications

  • Fan motor control
  • Pump motor control
  • Refrigerator compressor drive

Power Driver Modules Procurement Notes

Verify datasheet revision (PD-97277 Rev A) and manufacturer origin (Infineon/International Rectifier). Confirm pin-out compatibility with existing designs. Ensure thermal management meets case temperature limits (-20 to +100°C). Validate logic voltage levels against system requirements.

Power Driver Modules Selection Notes

Select based on required RMS phase current and PWM switching frequency. Consider thermal resistance and maximum junction temperature (+150°C). Evaluate internal thermistor characteristics for temperature monitoring. Check bootstrap capacitor requirements based on operating frequency.

Power Driver Modules Part Context

Part of the IRAM336 series of integrated power hybrid ICs. Designed specifically for appliance motor drive applications requiring compact solutions. Combines power MOSFETs with advanced driver circuitry in a single module.

Power Driver Modules Replacement Considerations

Check for direct substitutes within the IRAM336 series or similar Infineon hybrid modules. Verify pin compatibility and electrical specifications before substitution.

Power Driver Modules FAQ

How does the device handle high-side driver power?

It uses internal bootstrap diodes to generate bootstrapped power supplies for the high-side drivers, eliminating the need for isolated power supplies.

What logic voltage levels are supported?

The integrated HVIC driver is compatible with both 3.3V and 5V input logic levels.

Is the module electrically isolated?

No, the case is connected to the negative DC bus and is not isolated. Isolation material between the case and heat sink is recommended.

IRAM336-025SB3IRAM336-025SB3
$7.33
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