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IRF540NLPBF is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 100V 33A TO262. Review the specifications below when checking this part for your BOM.
The IRF540NLPBF is a single N-channel enhancement mode power MOSFET from the HEXFET family, manufactured by Infineon Technologies. It utilizes advanced processing techniques to achieve an ultra-low on-resistance of 44 mΩ at VGS = 10V and ID = 16A. The device supports a continuous drain current of 33 A at 25°C case temperature and handles pulsed currents up to 110 A. It features a maximum drain-to-source breakdown voltage of 100 V and operates within a junction temperature range of -55°C to +175°C. The component is housed in a TO-262 (D2Pak) surface-mount package with three pins.
Verify the specific ordering suffix against official Infineon documentation to confirm the lead-free designation and package type. Ensure that the TO-262 footprint matches the recommended layout provided in application notes. Confirm compliance requirements such as RoHS status directly from the manufacturer's datasheet before finalizing procurement specifications.
Select this component when a surface-mount solution is required for high-current applications needing low conduction losses. Consider the thermal resistance values and derating factors for the intended operating environment. Evaluate the gate charge parameters relative to the driving circuitry to ensure efficient switching performance within the specified voltage limits.
This part belongs to the HEXFET power MOSFET series, known for combining fast switching speeds with ruggedized designs. The TO-262 package provides high power capability and the lowest possible on-resistance among existing surface mount packages of its class. It serves as the through-hole compatible alternative to the standard D2Pak version for specific mounting needs.
The IRF540NSPbF is the surface mount variant within the same electrical specification family. Verify pinout compatibility and thermal performance differences between the TO-262 and other available packages before substitution.
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