FET, MOSFET Arrays IRF7509TRPBF product image

IRF7509TRPBF

$1.03
  • Description:MOSFET N/P-CH 30V 2.7A/2A MICRO8
  • Series:HEXFET®

SKU:36863247e2b8 Category: Brand:

  
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IRF7509TRPBF is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N/P-CH 30V 2.7A/2A MICRO8. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for IRF7509TRPBF

  • Description:MOSFET N/P-CH 30V 2.7A/2A MICRO8
  • Series:HEXFET®
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:N and P-Channel
  • FET Feature:Logic Level Gate
  • Drain to Source Voltage (Vdss):30V
  • Current - Continuous Drain (Id) @ 25°C:2.7A, 2A
  • Rds On (Max) @ Id, Vgs:110mOhm @ 1.7A, 10V
  • Vgs(th) (Max) @ Id:1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:12nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:210pF @ 25V
  • Power - Max:1.25W
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package:Micro8™
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for IRF7509TRPBF

IRF7509TRPBF

FET, MOSFET Arrays Overview

The IRF7509TRPBF is a dual N-channel and P-channel enhancement mode MOSFET from the Fifth Generation HEXFET series. It utilizes advanced processing for ultra-low on-resistance within a compact Micro8 surface-mount package. The device features a low profile of less than 1.1mm, making it suitable for space-constrained environments. Key electrical parameters include a drain-source voltage of 30V for both channels, continuous drain currents of 2.7A (N-Channel) and -2.0A (P-Channel) at 25°C, and maximum power dissipation of 1.25W.

FET, MOSFET Arrays Feature Summary

  • Dual N-Channel and P-Channel configuration in a single component
  • Ultra-low on-resistance achieved through Fifth Generation HEXFET technology
  • Micro8 package provides minimal footprint area compared to standard SOIC-8
  • Low profile design under 1.1mm height for thin application compatibility

FET, MOSFET Arrays Applications

  • Portable electronics requiring small form factors
  • PCMCIA cards with limited board space
  • Battery-powered devices utilizing low-voltage logic levels
  • Power management circuits in compact consumer hardware

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm packaging type and lead-free status. Ensure the procurement channel sources directly from authorized distributors or the manufacturer to guarantee authenticity. Cross-reference the part number with the latest datasheet revision to confirm compliance with current RoHS directives and material declarations before finalizing orders.

FET, MOSFET Arrays Selection Notes

Select this component when simultaneous N-type and P-type switching is required in a minimal physical footprint. The Micro8 package is optimal for designs where standard SOIC-8 dimensions exceed available PCB real estate. Consider the thermal resistance characteristics and derating curves for high-temperature operation scenarios. Evaluate the gate charge requirements against the driving circuit capabilities to ensure adequate switching speeds.

FET, MOSFET Arrays Part Context

This device belongs to the HEXFET Power MOSFET family, known for ruggedized design and fast switching speeds. The Micro8 package represents a specialized variant designed specifically for applications demanding the smallest possible outline within an SOIC-compatible footprint. It integrates two independent transistors into one assembly to reduce component count and simplify layout.

FET, MOSFET Arrays Replacement Considerations

IRF7309TRPBF: Similar dual N/P channel MOSFET but housed in a standard SOIC-8 package rather than the smaller Micro8 outline.

IRF7509TRPBFIRF7509TRPBF
$1.03
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