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IRFR540ZTRPBF is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 100V 35A DPAK. Review the specifications below when checking this part for your BOM.
The IRFR540ZTRPBF is a single N-channel HEXFET power MOSFET manufactured by Infineon Technologies. It features a 100V drain-source breakdown voltage and a maximum on-resistance of 28.5mΩ at VGS=10V. The device supports a continuous drain current of 35A at 25°C case temperature and handles a pulsed drain current of 140A. Total gate charge is typically 39nC, with input capacitance of 1690pF. Power dissipation reaches 91W at 25°C case temperature. The component operates within a junction temperature range of -55°C to +175°C and utilizes the D-Pak (TO-252) surface-mount package.
Verify that the ordering suffix TRRPBF corresponds to the tape-and-reel packaging format required for automated assembly processes. Confirm the specific manufacturing date code and lot traceability align with project quality standards. Ensure compliance with RoHS and REACH directives as indicated in the official documentation before finalizing procurement orders.
Select this component when a 100V rating and low conduction losses are critical for the design. Evaluate the thermal management requirements based on the 1.64°C/W junction-to-case thermal resistance. Consider the 35A continuous current capability relative to the expected load profile and ambient operating conditions to ensure reliable performance.
This part belongs to the HEXFET family of power MOSFETs from Infineon Technologies. It represents a standard industrial-grade discrete semiconductor designed for robust switching performance. The device integrates an intrinsic body diode suitable for inductive load commutation.
IRFR540ZPbF
Yes, the datasheet explicitly states that repetitive avalanche operation is allowed up to the maximum junction temperature (Tjmax).
The internal source inductance is typically 7.5nH, measured between the package lead and the center of the die contact.
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