SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
IRFSL4310PBF is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 100V 130A TO262. Review the specifications below when checking this part for your BOM.
The IRFSL4310PBF is a single N-channel HEXFET power MOSFET manufactured by Infineon Technologies. It utilizes the TO-262 (I2PAK) through-hole package and operates with a drain-source breakdown voltage of 100 V. The device supports a continuous drain current of 130 A at a case temperature of 25°C, with a maximum on-resistance of 7.0 mΩ. Key electrical parameters include a gate threshold voltage ranging from 2.0 V to 4.0 V, a total gate charge of 170 nC, and a forward transconductance of 160 S. It features an operating junction temperature range from -55°C to +175°C.
Verify component authenticity against official Infineon or authorized distributor channels. Confirm the specific TO-262 package marking matches the datasheet specifications. Ensure thermal management design accommodates the specified junction-to-case thermal resistance values under intended load conditions. Check for RoHS compliance documentation if required by local regulations.
Select this component when a robust N-channel MOSFET with high current handling and low on-resistance is required for through-hole mounting. The TO-262 package provides superior thermal dissipation compared to surface mount alternatives. Consider the 100 V rating and 130 A current capacity relative to system peak loads and thermal constraints.
This part belongs to the HEXFET family of power MOSFETs from Infineon Technologies. It shares functional similarities with other variants like the IRFS4310 and IRFB4310, differing primarily in package type. The TO-262 configuration offers distinct mechanical and thermal characteristics suitable for specific board layout and heat sinking requirements.
Direct substitutes include IRFS4310PBF and IRFB4310PBF. Verify pinout compatibility and ensure the replacement package fits the existing footprint. Thermal resistance and current derating curves must be reviewed to maintain equivalent performance levels.
Explore related parts through FETs, MOSFETs, Transistors, Discrete Semiconductor Products, all product categories.